6.777J/2.751J Material Property
Database
Material: Aluminum
Oxide
Property |
Value |
Reference |
Image/URL (optional) |
Mass density |
3960 kg/m^3 |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Young's
modulus |
370 Gpa |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Poisson ratio |
0.2 |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Stiffness
Constants |
Not found |
|
|
Tensile or
fracture strength |
300 MPa |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Residual
stress on silicon |
Not found |
|
|
Specific heat |
850 J/(kgK) |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Thermal
conductivity |
30 W/(mK) |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Dielectric
constant |
9.9 |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Index of
refraction |
1.76 |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Electrical
conductivity |
1e-14 /ohm/cm |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Magnetic
permeability |
Susceptibility k=-3.7e-5
m^3/mol |
m=1+4pk E.W.Lee, “Magnetism:
an Introductory Survey” |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
Piezoresistivity |
N/A |
|
|
Piezoelectricity |
Not found |
|
|
Wet etching
method |
Ar+ bombardment
then H3PO4 etch |
|
|
Plasma etching
method |
Not found |
|
|
Adhesion to
silicon dioxide |
Not found |
|
|
Biocompatibility |
Yes |
|
|
Hydrophobicity |
Not found |
|
|
Melting Point |
2054 C |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |
CTE |
7.4e-6 /K |
Matweb.com |
http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A |