6.777J/2.751J Material Property Database

Material: Aluminum (incl. alloys w/ Si or Si+Cu)

Property	Value	Reference	Image/URL (optional)
Mass density	2700 kg/m^3	CRC Materials Science and Engineering Handbook, p.46	http://www.memsnet.org/material/aluminumalbulk/
Young's modulus	70 GPa	Thin Solid Films,270(1995), p.263	http://www.memsnet.org/material/aluminumalbulk/
Poisson ratio	0.33	Microprobe-type measurement of Young's modulus and Poisson coefficient by means of depth sensing indentation and acoustic microscopy, Comte, C. von Stebut, J. Surface & Coatings Technology, v 154, n 1, 1 May 2002, p 42-8
Stiffness Constants
Tensile or fracture strength	Pure aluminum: 47 MPa Film in the article: 70 MPa	Aluminum deposition by using MOCVD on pitch based carbon fibers, Suzuki, T., Materials Science and Engineering Serving Society. Proceedings of the Third Okinaga Symposium on Materials Science and Engineering Serving Society, 1998, p 210-13
Residual stress on silicon	-20 to -30 MPa unannealed 120 to 140 MPa annealed at 450C	X-ray determination of the residual stresses in thin aluminum films deposited on silicon substrates, Korhonen, M.A., Paszkiet, C.A., Scripta Metallurgica, v 23, n 8, Aug. 1989, p 1449-53
Specific heat	898.7 J/kg/K	CRC Materials Science and Engineering Handbook, p.260	http://www.memsnet.org/material/aluminumalbulk/
Thermal conductivity	237 W/m/K	CRC Materials Science and Engineering Handbook, p.270-274	http://www.memsnet.org/material/aluminumalbulk/
Dielectric constant	Aluminum powder 1.6-1.8	Dielectric Constant Reference Guide	http://www.asiinstr.com/dc1.html#List
Index of refraction	1.44	Chemical Properties Handbook Edited by Yaws, C.L. 1999; McGraw-Hill
Electrical conductivity	3.538x10^7 S/m	Nondestructive Testing Resource Center	http://www.ndt-ed.org/GeneralResources/MaterialProperties/ET/ET_matlprop_Aluminum.htm
Magnetic permeability	μr=1 Susceptibility = 6x10-7 cgs	Basic analysis of a metal detector Yamazaki, S.; Nakane, H.; Tanaka, A., IEEE Transactions on Instrumentation and Measurement, Volume: 51,   Issue: 4,   Year: Aug 2002, Page(s): 810- 814	Susceptibility from http://www.matweb.com/search/SpecificMaterial.asp?bassnum=MEAl00
Piezoresistivity	2x10-5 Ohm-cm	Determination of the coefficient of piezoresistivity in aluminum alloy interconnect structures Reilly, C.J., Sanchez, J.E., Jr, Materials Reliability in Microelectronics IX. Symposium, 1999, p 213-18
Piezoelectricity
Wet etching method	85 wt.% phosphoric acid solution	Wet etching mechanisms of aluminum electrodes under the low pressure-linewidth narrowing phenomena Uchiyama, M.; Nakamura, M. Denki Kagaku, v 56, n 7, July 1988, p 563-8
Plasma etching method	Cl2, BCl3/Cl2	Langmuir probe studies of a transformer-coupled plasma, aluminum etcher Malyshev, M.V.; Donnelly, V.M.; Kornblit, A.; Ciampa, N.A.; Colonell, J.I.; Lee, J.T.C. Source: Journal of Vacuum Science & Technology A (Vacuum, Surfaces, and Films), v 17, n 2, March 1999, p 480-92
Adhesion to silicon dioxide	good	The reaction of Al with vitreous silica Black, J.R., 15th Annual Proceedings Reliability Physics, 1977, p 257-61
Biocompatibility	no	Dependence of in vitro biocompatibility of ionomeric cements on ion release, A. J. Devlin, Journal of Materials Science: Materials in Medicine 9(12): 737-741; Dec 1998	Medical Device Link - MDDI July 2002 Metalworking: Making the Cuts of Tomorrow, Today Medical device... URL: http://www.devicelink.com:80/mddi/archive/02/07/001.html
Hydrophobicity	90 degrees below 120C	Contact angle temperature dependence for water droplets on practical aluminum surfaces Bernardin, J.D.; Mudawar, I.; Walsh, C.B.; Franses, E.I.International Journal of Heat and Mass Transfer, v 40, n 5, March 1997, p 1017-33