6.777J/2.751J Material Property Database

 

Material: APCVD Silicon Dioxide

 

Property

Value

Reference

Image/URL (optional)

Mass density

2.2 g/cm³

IEEE Transactions on electron devices,Vol.ED25,No.10,Oct1978, p.1249

 

Young's modulus

69 GPa

S. D. Senturia, Microsystem Design. Boston: Kluwer Academic Publishers, 20

 

Poisson ratio

0.17

S.D. Senturia, Microsystem Design, Kluwer Academic Publishers, 2001, p.196

 

Stiffness Constants

 

Depends on shape and Young´s modulus

 

Tensile or fracture strength

3.18 GPa

J. Foggiato. Handbook of Thin Film Deposition Processes and Techniques- Principles, Methods, Equipment and Applications. 2002

 

Residual stress on silicon

50-100 MPa

H. Kotami, et. al., "Low-Temperature APCVD Oxide Using TEOS-Ozone Chemistry for Multilevel Interconnects", IEEE Electron Devices Meeting Technical Digest, 1989, p. 672. See attached plot for temperature dependence

 

Specific heat

745 J/kgK

F. P. Incropera and D. P. DeWitt, Fundamentals of Heat and Mass Transfer, fourth edition. New York: Wiley, 1996

 

Thermal conductivity

1.38 W/m*K

F. P. Incropera and D. P. DeWitt, Fundamentals of Heat and Mass Transfer, fourth edition. New York: Wiley, 1996

 

Dielectric constant

4.15

Plummer, et al, Silicon VLSI Technology, Prentice Hall, 2000, p.708

 

Index of refraction

1.44

S. Rojas, L. Zanotti, A. Sassella and G.U. Pignatel. 1993. Characterization of silicon dioxide and phosphosilicate glass deposited films. Journal of Vacuum Science and Technology B Nov-Dec 11(6): 2081-9

 

Electrical conductivity

 

 

 

Magnetic permeability

-

 

 

Piezoresistivity

-

 

 

Piezoelectricity

-

 

 

Wet etching method

100 nm/min with HF solution (1:10)

S. Rojas, L. Zanotti, A. Sassella and G.U. Pignatel. 1993. Characterization of silicon dioxide and phosphosilicate glass deposited films. Journal of Vacuum Science and Technology B Nov-Dec 11(6): 2081-9

 

Plasma etching method

CF4/H2 gas

S.D. Senturia, Microsystem Design, Kluwer Academic Publishers, 2001, p.68

 

Adhesion to silicon dioxide

-

 

 

Biocompatibility

good

G. Voskerician et al. / Biomaterials 24 (2003) 1959–1967. Biocompatibility and biofouling of MEMS drug delivery devices

 

http://www1.elsevier.com

/gej-ng/10/24/19/85/56

/29/article.pdf

Hydrophobicity