6.777J/2.751J Material Property
Database
Material: APCVD
Silicon Dioxide
Property |
Value |
Reference |
Image/URL (optional) |
Mass density |
2.2 g/cm³ |
IEEE
Transactions on electron devices,Vol.ED25,No.10,Oct1978, p.1249 |
|
Young's modulus |
69 GPa |
S. D. Senturia,
Microsystem Design. Boston: Kluwer Academic
Publishers, 20 |
|
Poisson ratio |
0.17 |
S.D. Senturia,
Microsystem Design, Kluwer Academic Publishers,
2001, p.196 |
|
Stiffness Constants |
|
Depends on shape and Young´s modulus |
|
Tensile or fracture strength |
3.18 GPa |
J. Foggiato.
Handbook of Thin Film Deposition Processes and Techniques- Principles,
Methods, Equipment and Applications. 2002 |
|
Residual stress on silicon |
50-100 MPa |
H. Kotami,
et. al., "Low-Temperature APCVD Oxide Using TEOS-Ozone Chemistry for
Multilevel Interconnects", IEEE Electron Devices Meeting Technical
Digest, 1989, p. 672. See attached plot for temperature dependence |
|
Specific heat |
745 J/kgK |
F. P. Incropera
and D. P. DeWitt, Fundamentals of Heat and Mass Transfer, fourth edition. New
York: Wiley, 1996 |
|
Thermal conductivity |
1.38 W/m*K |
F. P. Incropera
and D. P. DeWitt, Fundamentals of Heat and Mass Transfer, fourth edition. New
York: Wiley, 1996 |
|
Dielectric constant |
4.15 |
Plummer, et al, Silicon VLSI
Technology, Prentice Hall, 2000, p.708 |
|
Index of refraction |
1.44 |
S.
Rojas, L. Zanotti, A. Sassella and G.U. Pignatel. 1993. Characterization of
silicon dioxide and phosphosilicate glass deposited
films. Journal of Vacuum Science and Technology B Nov-Dec 11(6): 2081-9 |
|
Electrical conductivity |
|
|
|
Magnetic permeability |
- |
|
|
Piezoresistivity |
- |
|
|
Piezoelectricity |
- |
|
|
Wet etching method |
100 nm/min with HF solution
(1:10) |
S.
Rojas, L. Zanotti, A. Sassella and G.U. Pignatel. 1993. Characterization of
silicon dioxide and phosphosilicate glass deposited
films. Journal of Vacuum Science and Technology B Nov-Dec 11(6): 2081-9 |
|
Plasma etching method |
CF4/H2 gas |
S.D. Senturia,
Microsystem Design, Kluwer Academic Publishers,
2001, p.68 |
|
Adhesion to silicon dioxide |
- |
|
|
Biocompatibility |
good |
G. Voskerician et al. / Biomaterials 24
(2003) 1959–1967. Biocompatibility and biofouling
of MEMS drug delivery devices |
/gej-ng/10/24/19/85/56 /29/article.pdf |
Hydrophobicity |
|
|
|