6.777J/2.751J Material Property Database

 

Material: LPCVD Silicon Nitride (silicon-rich)

 

Property

Value

Reference

Image/URL (optional)

Mass density

3000 kg/m3

Senturia, “Microsystem Design”, p.196

 

Young's modulus

290 GPa

http://www.memsnet.org/material/siliconnitridesi3n4film/

 

Poisson ratio

0.27

Senturia, “Microsystem Design”, p.196

 

Stiffness Constants

-

 

 

Tensile or fracture strength

5.8 - 8.5 MPa-m½

http://www.matweb.com/

 

Residual stress on silicon

-50 - +800Mpa

Senturia, “Microsystem Design”, p.196

 

Specific heat

~0.7 kJ/kg-K

http://www.matweb.com/

 

Thermal conductivity

15-30 W/m-K

Plummer, “Silicon VLSI Technology”, p.789

 

Dielectric constant

k ~6-7

www.semiconductorglossary.com

 

Index of refraction

1.8-2.2

Plummer, “Silicon VLSI Technology”, p.789

 

Electrical resistivity

1013 Wcm

http://www.matweb.com/

 

Magnetic permeability

-

 

 

Piezoresistivity

-

 

 

Piezoelectricity

-

 

 

Wet etching method

1) hot phosphoric acid

2) HF (0.5-1 nm/min) - slow

1) Senturia, “Microsystem Design”, p.58

2) Plummer, “Silicon VLSI Technology”, p.789

 

Plasma etching method

CF4/O2

Senturia, “Microsystem Design”, p.69

 

 

Adhesion to silicon dioxide

An excellent barrier (mask) against oxidization of Si

Senturia, “Microsystem Design”, p.37

 

Biocompatibility

Very biocompatible

Voskerician et al., Biocompatibility and biofouling of MEMS drug delivery devices, Biomaterials, Volume 24, Issue 11, May 2003, Pages 1959-1967

 

Hydrophobicity

-

 

 

 

J.P. Urbanski

6.777 Assignment #2 – February 19, 2004