6.777J/2.751J Material Property
Database
Material: LPCVD
Silicon Nitride (stoichiometric)
Property |
Value |
Reference |
Image/URL (optional) |
Mass density |
3.18
g/cm^3 |
Pierson,
Hugh O., Handbook of chemical vapor deposition |
|
Young's modulus |
270 Gpa |
Pierson,
Hugh O., Handbook of chemical vapor deposition (CVD) : |
|
Poisson ratio |
0.27 |
Pierson,
Hugh O., Handbook of chemical vapor deposition (CVD) : |
|
Stiffness Constants |
- |
|
|
Tensile or fracture strength |
980 MPA |
Senturia, Stephen, Microsystems Design |
|
Residual stress on silicon |
1100 |
MPA Senturia, Stephen, Microsystems Design |
|
Specific heat |
0.54-0.7 J/g K |
Pierson,
Hugh O., Handbook of chemical vapor deposition |
|
Thermal conductivity |
25-36 W/m C |
Pierson, Hugh O., Handbook of
chemical vapor deposition |
|
Dielectric constant |
7.9-8.14 |
Pierson, Hugh O., Handbook of
chemical vapor deposition (CVD) : |
|
Index of refraction |
2.01 |
Madou, Marc J., Fundamentals of
microfabrication : the science of |
|
Electrical conductivity |
- |
Resistivity: 10^16 Ohm-cm Madou, Marc J., Fundamentals of |
|
Magnetic permeability |
- |
|
|
Piezoresistivity |
- |
|
|
Piezoelectricity |
- |
|
|
Wet etching method |
H3PO4, BHF, HF |
Madou, Marc J., Fundamentals of
microfabrication : the |
|
Plasma etching method |
- |
|
|
Adhesion to silicon dioxide |
good |
http://www.biomems.net/Classes/MSE621/MSE62101(14).pdf |
|
Biocompatibility |
|
|
|
Hydrophobicity |
|
|
|