6.777J/2.751J Material Property Database

Material: Nickel (PVD or electroplated)

Property	Value	Reference	Image/URL (optional)
Mass density	8900 kg/m^3 (bulk)	A. F. Mills, Basic Heat and Mass Transfer, 2^nd Ed.
Young's modulus	200GPa	S. Basrour, Materials Science and Engineering A288 (2000) 160-163
Poisson ratio	.31 (bulk)	Thin film value reported to be lower than bulk, but could not get full paper with data, only abstract. J. A. Rudd, Journal of Mat. Reas. (1993) 8(1) 112-117	www.matweb.com (bulk)
Stiffness Constants	C11 = 2.45, C12 = 1.40, C44 = 1.25	G.A. Alers et al, J. Phys. Chem. Solids, 13, 40 (1960)
Tensile or fracture strength	Function of thickness (see table 2, pp 7)	Electrodeposition - The Materials Science of Coatings and Substrates by Dini, J.W. © 1993
Residual stress on silicon	Plots given for various thickness	K. Van Acker et al, J. Appl. Cryst. (1994) 27, 56-66
*Specific heat	444 J/kg/K (bulk)	A. F. Mills, Basic Heat and Mass Transfer, 2^nd Ed.
*Thermal conductivity	91 W/m/K (bulk)	A. F. Mills, Basic Heat and Mass Transfer, 2^nd Ed.
Dielectric constant	Function of frequency (data given in paper for various frequencies)	D.W. Lynch, Solid State Communications, Vol. 9, 2195 (1971)
Index of refraction	Function of frequency (data given in paper for various frequencies)	D.W. Lynch, Solid State Communications, Vol. 9, 2195 (1971)
*Electrical conductivity	1.43 x 10^7/Ohm-m	Web elements	www.webelements.com
Magnetic permeability	1240, for frequencies below MHz.		www.matweb.com
Piezoresistivity	N/A for metal
Piezoelectricity	N/A for metal
Wet etching method	Transene Nickel TFB 0.1096 um/min.		www.mems-exchange.org
Plasma etching method	Lam Rainbow 9600 Metal Etch System		wwwmtl.mit.edu/mtlhome/ 3Mfab/sop/rainbow.html
Adhesion to silicon dioxide	Good, and is used to help bond other materials to SiO2	IEEE, vol 26, 1 (2003) pp80-88
Biocompatibility	Yes for Ni alloys, e.g., TiNi. Ni in small amounts is not harmful to humans	Materials Science Forum, v 426-432, pt.4, 2003, p 3055-60
Hydrophobicity	Hydrophobic	Socha, Robert Piotr: The Influence of SiC Oxidation on Electrochemical Codeposition of SiC Particles with Nickel. University of Turku, Department of Physics, FIN-20014 Turku, Finland.

*Ni is a metal, with electrons being the primary carrier for both charge and heat. Because the mean free path of the electron (at room temperature) is orders of magnitude lower than any thin-film thickness, electrical and thermal properties for the thin film take on bulk values. (G. Chen, “Nanoscale Energy Transport Processes” (to be published))