6.777J/2.751J Material Property Database

 

Material: parylene

 

Property

Value

Reference

Image/URL (optional)

Mass density

1.289

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Young's modulus

400,000

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Poisson ratio

0.4

Residual Stress in Thin-Film Parylene-C, T. A. Harder et. al., MEMS 2002

 

Stiffness Constants

 

 

 

Tensile or fracture strength

10,000 (psi)

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Residual stress on silicon

37.8 – 44.4

(depending on annealing temp)

Residual Stress in Thin-Film Parylene-C, T. A. Harder et. al., MEMS 2002

 

Specific heat

0.17

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Thermal conductivity

2.0x10-4

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Dielectric constant

3.15 (60Hz)

3.10 (1KHz)

2.95 (1MHz)

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Index of refraction

1.639

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Electrical conductivity

10-14

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Magnetic permeability

 

 

 

Piezoresistivity

 

 

 

Piezoelectricity

 

 

 

Wet etching method

none

Robust Parylene-to-Silicon Mechanical Anchoring

 

Plasma etching method

O2 plasma

 

 

Adhesion to silicon dioxide

bad.

can be improved by A-174 silane

Flexible Parylene Actuator for Micro Adaptive Flow Control, T. N. Pronsin-Sirirak et. al.,  MEMS 2001

 

Biocompatibility

very good

 

 

Hydrophobicity

(highly hydrophobic)

 

 

Melting Point

290

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