6.777J/2.751J Material Property Database

Material: Thermal silicon oxide

Property	Value	Reference	Image/URL (optional)
Mass density	2200 kg/m^3	IEEE Transactions on electron devices,Vol.ED25,No.10,Oct1978, p.1249	here
Young's modulus	70(wet grown) 57(dry grown)	Thin Solid Films,283(1996), p.15, IEEE Transactions on electron devices,Vol.ED25,No.10,Oct1978, p.1249	here
Poisson ratio	0.17	Thin Solid Films,283(1996), p.15	here
Stiffness Constants	Since films are amorphous, see Young’s modulus
Tensile or fracture strength	110 MPa (tensile strength), 690-1380 MPa (compressive strength)	AZOM
Residual stress on silicon	-300 MPa (biaxial), -275 to -225 MPa (wet 950 deg C)	MEMS Clearinghouse, IEEE MEMS Workshop, p.223, 1993
Specific heat	1.0 J/gK	A.S. Grove: Physics and Technology of Semiconductor Devices
Thermal conductivity	1.4 W/mK	A.S. Grove: Physics and Technology of Semiconductor Devices
Dielectric constant	3.9	Muller and Kamins: Device Electronics for Integrated Circuits
Index of refraction	1.46	Michelle M. Gauthier, Engineering Materials Handbook, ASM desk edition. Materials Park, OH, Nov 1995.
Electrical conductivity	Insulator, 10^-12 S/cm	Michelle M. Gauthier, Engineering Materials Handbook,
Magnetic permeability	Must be small, most probably zero, because amorphous
Piezoresistivity	No, since amorphous
Piezoelectricity	No, amorphous
Wet etching method	Buffered HF	Steve Senturia’s book
Plasma etching method	CF4/H2	Steve Senturia’s book
Adhesion to silicon dioxide	Hm… very adhesive J
Biocompatibility	Compatible (a piece of glass in a tissue will probably not cause repelling)
Hydrophobicity	Hydrophilic, but not too much (drop some water on a glass)