Nanomagnets and Magnetic
Random Access Memories
Sponsors
National Science Foundation, Singapore-MIT Alliance, Outgoing
Marie Curie Fellowship.
Project Staff
C. A. Ross, F. J. Castaño, D. Morecroft, W. Jung, J.D. suh,
in collaboration with H. I. Smith, and J. Bland
We use a range of lithography techniques (electron-beam
lithography, interference lithography, block copolymer lithography,
zone-plate array lithography) to produce arrays of ‘nanomagnets’.
These tiny structures have thicknesses of a few nanometers and lateral
dimensions between tens of nm and a few microns. Arrays of these
elements can be made with spatial periods of 100 nm and above. The
nanomagnets are made by evaporation or sputtering combined with
liftoff or etching. We measure the switching mechanisms of the particles,
the thermal stability of their magnetization, and interparticle
interactions, and we consider their suitability for various data-storage
schemes. The behavior of individual particles can be measured using
magnetic-force microscopy, while the collective behavior of arrays
of particles can be measured using magnetometry. We also measure
magnetotransport of patterned structures, and use micromagnetic
modeling to understand the hysteresis behavior and remanent states
of small magnetic structures. Recently we have concentrated on thin
film multilayer structures such as pseudo-spin valves, exchange-pinned
bilayers, or spin valves.
Nanomagnets have potential uses in ‘patterned media’,
magnetic random access memories (MRAM) and other magneto-electronic
applications. Current MRAM devices rely on bar-shaped multilayered
magnetoresistive nanomagnets in which a bit of data is stored
depending on the relative orientation between the magnetization
of the different magnetic layers in the structure. An alternative
possibility for high-density MRAMs is to use a ring-shaped nanomagnet,
in which a bit of information is stored by magnetizing the ring
clockwise or counterclockwise (a ‘vortex’ state) or
with two domain walls (an ‘onion’ state). We have
characterized the behavior of circular and elliptical rings of
various materials and dimensions. We have made electrical connections
to these structures and have characterized the anisotropic magnetoresistance
of NiFe single-layer rings, and the giant magnetoresistance of
NiFe/Cu/Co multilayer rings.
Multilayer rings show unique behavior due to the interactions
between domain walls in the two layers. While the resistance of
a bar-shape element displays two resistance levels on cycling
the free (NiFe) layer, the rings display additional intermediate
resistance levels reached through abrupt transitions. Additionally,
the storage (Co) layer can be cycled into different states, allowing
for profoundly different device responses when the free layer
is switched. We have explored the switching mechanisms of PSV
ring structures using micro-magnetic simulations, as well as the
effect of the contact configuration on the device response. The
sharp, low-field resistance changes in these PSV rings, which
can be tailored by choice of ring dimensions and multilayer stack,
will make them attractive for magneto-electronic applications
such as memories or logic devices that require multiple stable
resistance levels. Most recently we are pursuing the option of
operating these devices using current pulses, rather than with
an applied magnetic field. In addition, in elliptical rings, we
have shown how shape and exchange bias can allow control of the
vortex circulation direction.

Scanning electron micrographs corresponding to elliptical
and circular ring devices made from NiFe/Cu/Co/Au multilayers and
Ta/Cu non-magnetic contact wires. The outer dimensions of the rings
ranged from 930 nm to 20 µm and the widths from 80 nm to 350
nm.

(a) Resistance versus applied field measurements on
switching the free (NiFe) layer of a 200nm-wide NiFe (6 nm) /Cu
(5 nm) /Co (6 nm) /Au (4 nm) bar-shaped device. (b) & (c) resistance
versus applied field corresponding to a 120nm-wide NiFe (4 nm) /Cu
(6 nm) /Co (8 nm) /Au (4 nm) elliptical ring, on switching the free
layer with the storage layer in different states.
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