MICHAEL J. WHITSON

		PO Box 390618, Cambridge MA 02139, USA
			   +1.617.378.8977
			   mwhitson@mit.edu
		     http://web.mit.edu/mwhitson

				* * *

OBJECTIVE:

    An exciting position in micro/nanofabrication research with
    long-term career growth potential.


EMPLOYMENT:

  OSRAM Opto Semiconductors, Regensburg, Germany
      Jun 2009 - Oct 2009

    Graduate intern, through the MIT Germany Program.  Implemented
    procedures to improve measurements of optical dispersion of thin
    films, using simultaneous parametric model fitting of multiple
    optical metrology datasets.  Delivered dispersion curves and
    optical models for several optical films representing significant
    improvements in quality of in-house data.

  Optron Systems, Bedford MA
      Apr 2008 - Feb 2009

    Research Engineer.  Performed microfabrication and process
    development for MOEMS diffractive membrane mirror light
    modulators.  Developed numerical wave optics analysis of modulator
    cells to aid in optimization of optical chain, using
    muldimensional Fourier analysis in MATLAB.

  Precision Compliant Systems Laboratory (MIT), Cambridge MA
      Sep 2006 - Dec 2007

    Research Assistant.  Collaborated on design of a mesoscale
    six-axis positioning system with nanometer / microradian-scale
    repeatability, based on the PCSL's HexFlex series of flexure
    stages.  Work included precision error budgeting, consultation on
    mechanism position sensor design, precision fixturing system
    design, and microfabrication process engineering.

  Esashi Laboratory (Tohoku University), Sendai, Japan
      Oct 2005 - Aug 2006

    Visiting researcher, through the MIT Japan Program. Performed
    device design, process design, analysis, and preliminary
    fabrication of a piezoelectric ultrasonic micro-resonator, to be
    used as an intravascular elastographic transducer. Participated in
    teaching rotation for laboratory-wide technical seminars and
    English lessons.

  Nantero, Woburn MA
      Jun 2004 - Sep 2005

    Micro/nanofabrication technician. Assisted device engineers with
    processing of prototype device wafers for company's core carbon
    nanotube memory and other products. Performed rapid device
    analyses to help set short-loop test goals.


EDUCATION:

  Massachusetts Institute of Technology, Cambridge MA
      S.B. June 2007
      M.Eng. candidate

    Received Bachelor of Science in Electrical Engineering and
    Computer Science with additional coursework in Materials Science
    and Engineering.  Areas of focus and graduate-level coursework
    included microfabrication, MEMS design, and nanoscale materials.
    On leave from M.Eng. program in EECS with one semester remaining.
    Cumulative GPA is 4.5/5.0.


SKILLS:

    Over 3 years of laboratory-scale cleanroom and microfabrication
    experience, focusing on small-run iterations of MEMS/NEMS device
    prototypes.  Process experience includes vacuum and plasma
    systems, UV and electron beam lithography, evaporation,
    sputtering, atomic layer deposition, reactive ion etch (including
    DRIE), lift-off, and wet etch processes.  Experience with optical,
    interferometric, atomic force, and scanning electron microscopy;
    spectroscopic ellipsometry and reflectometry.

    Experience with COMSOL, SolidWorks, AutoCAD, Coventor, LabView,
    MATLAB, Mathematica.  Technical writing experience in Word and
    LaTeX.  Proficient in VHDL, C, C++, Scheme, perl, and Unix shell
    scripts.  Nearly four years of experience with several types of
    Unix (including Solaris and GNU/Linux) as professional
    administrator and programmer.

    Proficient in conversational Japanese and Norwegian, some
    knowledge of German.


PUBLICATIONS:

  * Whitson, Esashi, Haga, et al., "Piezoelectric Resonator for
    Intravascular Ultrasonic Elastography." IEEJ Papers of Technical
    Meeting on Bio Micro Systems, v. BMS-06 (2006), p. 63.