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The Institute's major initiative to reengineer its administrative processes began its second stage on Monday when initial meetings were held, according to Professor James D. Bruce, program manager of the reengineering effort. Teams have been selected to redesign several activities outlined in the June 29 issue of Tech Talk.
Teams for the other initiatives will be put together over the next week. Membership in the teams will be announced shortly.
"We must take the lead in the higher education community to show how change in the service of education and research can be accomplished," President Charles M. Vest said in a letter read to the assembled reengineering group. President Vest was unable to attend the meeting because of a previously scheduled trip.
"The world is changing around us. It demands lower costs in education; it views us as clinging to the past, unwilling to change and improve," Dr. Vest said, noting that it is essential to regain the public's trust.
"Now many worry that reengineering can succeed only by paying the price of destroying institutional value and community. This is simply wrong. The contrary is the case. No matter how we reorganize and change, it will still be the values, loyalty, and commitment of people that will make MIT great in the future, just as it has in the past."
Senior Vice President William R. Dickson, who chairs the Reengineering Steering Committee, announced in June the six activities for initial redesign work: management reporting, supplier consolidation, the mail service, facilities operations, information technology and the appointment process. It is these activities that will be first redesigned for better efficiency and effectiveness.
The Institute is undergoing this intensive process to improve the services provided to students, faculty, staff and sponsors, to simplify the administrative processes that have become complex over the years, and to make substantial improvements in the Institute's budget.
A version of this article appeared in the August 17, 1994 issue of MIT Tech Talk (Volume 39, Number 2).