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02.07.2007: Will Arora (EECS)
Fabrication of Three-Dimensional Device Geometries by Folding and Stacking Nano-Patterned Membranes ("Nanostructured Origami")
Abstract:
Topologically complex three-dimensional (3D) semiconductor structures are difficult to manufacture but hold promise to improve existing devices and enable emerging devices. Some of these devices are multi-layer hybrid CMOS circuits and 3D photonic crystals. A common approach to 3D fabrication is to divide the final structure into layers that can be patterned with conventional, two-dimensional lithography and then arrange these layers in 3D. Wafer- and chip-scale bonding have been widely used to integrate separate systems in a 3D fashion. Another approach is to work with membranes which offer the advantages of being flexible and light-weight. These properties allow them to be both stiff and conformal, foldable and easy to bond. I will survey several different methods of folding, stacking and aligning membranes for 3D device fabrication and then present research from our group in these areas. Our research demonstrates that membranes can be patterned such that they self-assemble and self-align into 3D structures.
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