Case 11442

Transient Liquid Phase Bonding for Lower Temperature Joining of Co-Sintered Materials

Keywords:
Sintering, transient liquid phase (TLP) bonding

Applications:
Sintering and joining two or more materials for various applications like coating and metallization.

Problem:
To achieve a satisfactory degree of adhesion, the sintering and joining processes must be carried out at high temperatures.

Technology:
The invention presents a joining technique for bonding co-sintered materials at relatively low temperatures. The most general form of this invention relates to joining two powdered materials. The technique requires an additive with a lower melting point than the two host materials, which can react with one of the host materials to form a compound with a relatively high melting point.

Advantages:

Joining at lower temperatures allow for greater flexibility in fabrication and lower energy cost.

Process can be controlled so that materials remain uncontaminated.

Reaction phase with high melting point allowed joined materials to withstand high service temperatures.

Inventors:

Professor Christopher Schuh (Department of Material Sciences and Engineering, MIT)

Professor Thomas W. Eager (Department of Material Science and Engineering, MIT)

Yuttanant Boonyongmaneerat (Department of Material Sciences and Engineering, MIT)

Intellectual Property:
US Patent Application Number 11/795844, filed on April 11, 2008

PCT Patent Application Number US06/002699, filed on January 25, 2006

Publications:

Last revised: April 29, 2013

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