Sintering, transient liquid phase (TLP) bonding
Sintering and joining two or more materials for various applications like coating and metallization.
To achieve a satisfactory degree of adhesion, the sintering and joining processes must be carried out at high temperatures.
The invention presents a joining technique for bonding co-sintered materials at relatively low temperatures. The most general form of this invention relates to joining two powdered materials. The technique requires an additive with a lower melting point than the two host materials, which can react with one of the host materials to form a compound with a relatively high melting point.
US Patent Application Number 11/795844, filed on April 11, 2008
PCT Patent Application Number US06/002699, filed on January 25, 2006
Last revised: April 29, 2013