Case 11442

Transient Liquid Phase Bonding for Lower Temperature Joining of Co-Sintered Materials


Sintering, transient liquid phase (TLP) bonding


Sintering and joining two or more materials for various applications like coating and metallization.


To achieve a satisfactory degree of adhesion, the sintering and joining processes must be carried out at high temperatures.


The invention presents a joining technique for bonding co-sintered materials at relatively low temperatures. The most general form of this invention relates to joining two powdered materials. The technique requires an additive with a lower melting point than the two host materials, which can react with one of the host materials to form a compound with a relatively high melting point.

  • Joining at lower temperatures allow for greater flexibility in fabrication and lower energy cost.
  • Process can be controlled so that materials remain uncontaminated.
  • Reaction phase with high melting point allowed joined materials to withstand high service temperatures.


Intellectual Property:

US Patent Application Number 11/795844, filed on April 11, 2008

PCT Patent Application Number US06/002699, filed on January 25, 2006


Last revised: April 29, 2013

»List of MIT Energy IP«