Case 13427

Nanoparticle Thin-Film Coatings for Enhancements of the Boiling Heat Transfer

Keywords:

Nucleate boiling, heat transfer coefficient, critical heat flux, wettability improvement, layer-by-layer coating

Applications:

    The invention can be used to improve the power density of heat transfer for systems such as electronic devices, chemical reactors, refrigeration systems, boilers, etc.

Problem:

    Heat transfer process in electronic devices and other systems is inefficient due to low critical heat flux and low heat-transfer coefficient.

Technology:

A wettability improvement at a surface is thought to be responsible for a critical heat flux (CHF) enhancement, while changes in surface roughness are thought to be responsible for changes in the heat-transfer coefficient. The invention uses nanoparticle-based thin-film coatings on engineering surfaces to increase the boiling heat transfer coefficient and the boiling CHF. Using layer-by-layer assembly method, a superhydrophilic thin film is formed on the metal surface of a boiler vessel to alter the wettability and roughness of the surface, which in turn, changes the boiling behavior at the surface.

Advantages:
  • Increases heat-transfer coefficient and CHF
  • Maintains the operating heat flux below CHF
  • Higher power density and hence increases economic benefits

Inventors:
  • Professor Michael F. Rubner (Department of Materials Science and Engineering, MIT)
  • Professor Robert E. Cohen (Department of Chemical Engineering, MIT)
  • Professor Jacopo Buongiorno (Department of Nuclear Science and Engineering, MIT)
  • Lin-wen Hu (Nuclear Reactor Lab, MIT)
  • Eric Forrest (Department of Materials Science and Engineering, MIT)
  • Erik H. Williamson (Department of Materials Science and Engineering, MIT)

Intellectual Property:

US Patent Application Number 12/703228, filed February 10, 2010

Publications:

N/A

Last revised:January 18, 2013

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