Crystallographic grain boundary, electroplating, uniformity of dissolution, grain boundary engineering, thermo-mechanical process, isothermal deformation
High-purity metals including various kinds of face centered cubic (FCC) metals such as pure copper, other copper alloys, brass, pure nickel, nickel alloys and various kinds of austenitic stainless steels for
The most effective Grain Boundary Engineering (GBE) technologies reported to date involve many cycles of cold work/hot annealing, which would be especially inefficient in practice at large scales.
This invention is a new method of changing the internal structure of metals through a process of deformation and annealing. It pertains to changing the crystallographic types of grain boundaries to increase the fraction of “special” grain boundaries and to tailor desirable physical and chemical properties in metals. Instead of running cycles of "deformation at ambient temperature" and "annealing at apparently higher temperature than ambient temperature", the new isothermal thermo-mechanical process can help avoid time and energy-consuming heating or cooling steps.
U.S. Patent Application Number 12/544568, filed on August 20, 2009
Last revised: April 29, 2013
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