Differential sensor, Sensor skin, Structural Health Monitoring (SHM), Dielectric Electroactive Polymer (DEAP)
The invention provides a new structural health monitoring (SHM) system for civil structures that deploys layers of dielectric electroactive polymer (DEAP) on the surface of structural elements and regularly monitors any change in the structural state. DEAPs are highly sensitive to an applied strain, which causes a large and measureable change in the capacitance of the DEAP. With the electronics employed and a proper configuration of sensor patches, changes in strain on the monitored surface can be localized, which allows a more precise analysis of possible structural deficiencies. The system can provide real-time monitoring of civil structures in a large scale.
U.S. Patent Number 8,384,398, issued on February 26, 2013
Last revised: April 29, 2013
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