Case 14204/14605

Method for forming a contact layer having strong adhesion and exceptional uniformity on semiconductor or thermoelectric substrate


Semiconductors, electroplate, nanoparticle, low surface energy substrates


Manufacturing of various substrates, manufacturing of various micro/nano-structures


Difficult to electroplate on low surface energy substrates


This invention relates to a thin nanoparticle layer or self-assembled monolayer being initially deposited onto a semiconductor or thermoelectric substrate for electroplating an electrically conducting material and having strong adhesion and exceptional uniformity. The invention uses a seed layer that strongly adheres to the substrate to serve as nucleation sites. It is also discovered that these seed layers open up a voltage range such that metals can be selectively deposited onto the predetermined seeded regions only, thus opening new routes for selective area deposition.


Improved electrical and thermal conductivity at lower cost and higher throughput

  • Professor Gang Chen (MIT Mechanical Engineering Department)
  • Hsien-Ping Feng (MIT Mechanical Engineering Department)
  • Bo Yu (Boston College Physics Department)
  • Zhifeng Ren (Boston College Physics Department)
  • Shuo Chen (MIT Mechanical Engineering Department)
  • Bed Raj Poudel (GMZ Energy, Inc.)

Intellectual Property:

US Patent Application 12/932372 filed on February 24, 2011



Last revised: Aug 23, 2011

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