MIT Green Computing
   An Examination of the Environmental Effects of Computers at MIT

Resource Use

A tremendous amount of water is used in the manufacturing of semiconductor chips. Inherent to the process is keeping the system free of ions and other pollutants.

A significant amount of distilled/ion free water, energy, chemicals and hazardous gases are used in the manufacturing process. Some of these resources used and emitted for an Intel Microprocessor Fab are listed below.

Companies are required to declare their toxic use and waste. AMD's Toxic Release Inventory Report from 1990-2000 reveals a significant number of toxins and chemicals used in their process.

Next Section: Chemicals at a Fab

Gas, Chemical, and Water Use at an Intel Fab

  One 6" wafer*    Intel Rio Rancho NM** 
(5000/week x 52 weeks) 
  Projected 120 new fabs*** 
(annually based on projection)
 
Input              
cu. ft. bulk gases    3,200   832,000,000(832 mil)   99,840,000,000(99.8 bil)  
cu ft. hazardous gases    22   5,720,000(5.72 mil)   6,864,000,000(686.4 bil)  
gals DI water    2,275   591,500,500(591 mil)   70,980,000,000(70.9 bil)  
lbs chemicals    20   5.200,000(5.2 mil)   624,000,000(624 mil)  
kw hrs electrical power    285   74,100,000(74.1 mil)   8,892,000,000(8.8 bil)  
               
               
Output              
lbs sodium hydroxide    25   6,500,000(6.5 mil)   780,000,000(780 mil)  
gals. waste water    2840   738,400,000 
(738 mil)
  88,608,000,000(88.6 bil)  
lbs hazardous waste    7   1,820,000(1.8 mil)   218,400,000(218.4 mil)  
               
               
* Based on calculationby Graydon Larabee of Texas Instruments, 1993          
** Projections made basedon Intel data. The facility fabricates 8 inch wafers.              
*** Projections from SemiconductorInternational magazine, 1997              
               

 

 

Figure Source: Advanced Micro Devices
Table Source: Silicon Valley Toxic Coalition