"Chee Lip's current research focuses on the reliability of copper interconnects in integrated circuits."
We are pleased to announce that Mr. GAN Chee Lip won this year's award for "Best Paper in Reliability" at the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits. Mr. Gan is a postgraduate student of the AMMNS programme and under the supervision of Professor Carl Thompson of MIT, Associate Professor PEY Kin Leong of NTU and Associate Professor CHOI Wee Kiong of NUS.
GAN Chee Lip graduated from the National University of Singapore (NUS) in 1999 with a Bachelor’s Degree in Electrical Engineering (First Class Honors). In 1997, he studied at the University of British Columbia, Vancouver, for a semester under the Student Exchange Program. During his four years of undergraduate studies, he represented his University in table-tennis and contract bridge.
In 1999, Chee Lip enrolled in the Advanced Materials for Micro- and Nano-Systems (AMM&NS) program in the pioneer batch of students of the Singapore-MIT Alliance (SMA). He was a teaching assistant for the courses "Properties of Materials" and "Material Processing for Micro and Nano-Systems" in summer 2000 and fall 2001 respectively. He was a member of the students’ Facilities and Sports Committee that initiated and organized the inaugural SMA Inter-Program Games.
Chee Lip’s current research focuses on the reliability of copper interconnects in integrated circuits. Besides investigating the failure mechanisms of copper dual-damascene metallization, he also studies the reliability of circuit-level interconnects. His thesis advisors are Professor Carl V. THOMPSON (MIT), Associate Professor PEY Kin Leong (NTU) and Associate Professor CHOI Wee Kiong (NUS). His research collaborators include scientists and engineers from the Institute of Microelectronics (Singapore), Chartered Semiconductor Manufacturing (Singapore) and International SEMATECH (USA). He is also part of a larger research group involving Intel Corporation (USA), Sandia National Laboratory (USA) and Advanced Micro Devices (USA).
He has currently authored or co-authored four journal and conference papers. One of these papers was awarded the Best Paper in Reliability at the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits in 2002. He was invited to present this best paper at the 13th European Symposium Reliability of Electron Devices, Failure Physics and Analysis in Rimini, Italy last October 7th -11th, 2002.
Chee Lip studied at MIT in fall 1999 as part of his Ph.D. candidature in SMA, taking MIT courses with local students. He is currently at MIT for another semester, working on his research area and interacting with Professor Thompson’s research group.