Journal Publications
E.N. Wang, M. Bucaro, J.A. Taylor, P. Kolodner, J.
Aizenberg, T.N. Krupenkin, “Droplet Mixing on Electrically Tunable
Superhydrophobic Nanostructured Surfaces,” submitted 2007.
T.N. Krupenkin, J.A. Taylor, E.N. Wang, P. Kolodner,
M. Hodes, T.R. Salamon, “Reversible Wetting-Dewetting Transitions on
Electrically Tunable Superhydrophobic Nanostructured Surfaces,” Langmuir,
2007, 23(18), p. 9128-9133. [pdf]
E.N. Wang, S. Devasenathipathy, H. Lin, C.H. Hidrovo, J.G.
Santiago, K.E. Goodson, T.W. Kenny. “A Hybrid Method for Bubble
Reconstruction in Two-Phase Microchannels,” Experiments in Fluids,
2006, 40 (6), p.847-858. [pdf]
E.N. Wang, L. Zhang, L. Jiang, J.-M. Koo, J.G. Maveety, E.A.
Sanchez, K.E. Goodson, T.W. Kenny. “Micromachined Jets for Liquid
Impingement Cooling of VLSI Chips,” Journal of MicroElectroMechanical
Systems, 2004, 13(5), p.833-842. [pdf]
E.N. Wang, S. Devasenathipathy, J.G. Santiago, K.E. Goodson,
T.W. Kenny. “Nucleation and Growth of Vapor Bubbles in a Heated Silicon
Microchannel,” Journal of Heat Transfer, 2004, 126(4), p.497. [pdf]
L. Zhang, E.N. Wang, K.E. Goodson, T.W. Kenny. “Phase
Change Phenomena in Silicon Microchannels,” International
Journal of Heat and Mass Transfer, 2005, 48(8), p.1572-1582. [pdf]
T.W. Kenny, K.E. Goodson, J.G. Santiago, E. Wang, J.-M. Koo,
L. Jiang, L. Zhang, D.W. Fogg, S. Yao, K. Rose, R. Flynn, C.-H. Cheng, C.H.
Hidrovo. “Advanced Cooling Technologies for Microprocessors,” International
Journal of High Speed Electronics and Systems, 2006, 16(1), p.
301-313.
C.H. Hidrovo, T.A. Kramer, E.N. Wang, S. Vigneron, J.E.
Steinbrenner, J.-M. Koo, F.-M. Wang, D.W. Fogg, R.D. Flynn, E.S. Lee, C.-H.
Cheng, T.W. Kenny, J.K. Eaton, K.E. Goodson. “Two-Phase Microfluidics for
Semiconductor Circuits and Fuel Cells,” Heat Transfer Engineering,
2006, 27(4), p.53-63. [pdf]
A. Balandin,
K.L.Wang., S. Cai,, R. Li, C.R. Viswanathan, E.N. Wang, M. Wojtowicz.
“Investigation of Flicker Noise Level and Deep Levels in AlGaN/GaN
Heterostructure Field Effect Transistors,” Journal of Electronic Materials,
2000, 29(3), p.297-301.
Conference
Presentations/Proceedings
E.N. Wang, S. Devasenathipathy, H. Lin, C.H. Hidrovo, J.G.
Santiago, K.E. Goodson, T.W. Kenny. “A Bubble Reconstruction Method for
Two-Phase Microchannel Flows,” 58th Meeting of American
Physical Society/Division of Fluid Dynamics (APS/DFD), Chicago, IL,
November 20-22, 2005.
E.N. Wang, S. Devasenathipathy, H. Lin, C.H. Hidrovo, J.G.
Santiago, K.E. Goodson, T.W. Kenny. “Bubble Geometry Reconstruction for Force
Estimations in Two-Phase Microchannel Flows,” Physics and Chemistry of Microfluidics
- Gordon Research Conference, Oxford,
England,
August 21-26, 2005.
C.H. Hidrovo, T.A. Kramer, E.N. Wang, S. Vigneron, J.E.
Steinbrenner, J.-M. Koo, F.-M. Wang, D.W. Fogg, R.D. Flynn, E.S. Lee, C.-H.
Cheng, T.W. Kenny, J.K. Eaton, K.E. Goodson. “Two-Phase Microfluidics for
Semiconductor Circuits and Fuel Cells,” 3rd
International Conference on Microchannels and Minichannels, Toronto, Canada,
June 13-15, 2005.
R. Flynn, T.A. Kramer, J.-M. Koo, D.W. Fogg, C.-H. Cheng,
E.N. Wang, K.E. Goodson. “Convective Boiling in Silicon Microchannels with
Localized Heating and Thermometry,” 3rd International
Conference on Microchannels and Minichannels, Toronto, Canada,
June 13-15, 2005.
E.N. Wang, J.G. Santiago, K.E. Goodson, T.W. Kenny.
“Microjet Impingement Cooling with Phase Change,” Proceedings of the ASME
International Mechanical Engineering Congress & Exposition, Anaheim,
CA, November 13-19, 2004, IMECE2004-62176.
T.A. Kramer, R.D. Flynn, D.W. Fogg, E.N. Wang, C.H. Hidrovo,
R.S. Prasher, D.S. Chau, S. Narasimhan, K.E. Goodson. “Microchannel
Experimental Structure for Measuring Temperature Fields During Convective
Boiling,” Proceedings of the ASME International Mechanical Engineering
Congress & Exposition, Anaheim, CA, November 13-19, 2004, IMECE2004-61936.
E.N. Wang, S. Devasenathipathy, C.H. Hidrovo, D.W. Fogg,
J.-M. Koo, J.G. Santiago, K.E. Goodson, T.W. Kenny. “Liquid Velocity Fields
in Two-Phase Microchannel Convection,” Proceedings of 3rd
International Symposium on Two-Phase Flow Modelling and Experimentation, Pisa, Italy,
September 22-24, 2004.
E.N. Wang, S. Devasenathipathy, C.H. Hidrovo, D.W. Fogg,
J.-M. Koo, J.G. Santiago, K.E. Goodson, T.W. Kenny. “A Quantitative
Understanding of Transient Bubble Growth in Microchannels using µPIV,” Proceedings
of Hilton Head 2004: Solid-State Sensors & Actuator Workshop, Hilton
Head, SC, June 6-10, 2004.
E.N. Wang, S. Devasenathipathy, J.G. Santiago, K.E. Goodson,
T.W. Kenny. “Nucleation and Growth of Vapor Bubbles in a Heated Silicon
Microchannel,” ASME International Mechanical Engineering Congress & Exposition, Washington, D.C., Nov. 15-21, 2003.
J. Burney, T. Bay, P. Brink, B. Cabrera, P. Castle, R.
Romani, A. Tomada, S. Nam, A. Miller, J. Martinis, E.N. Wang, T. Kenny, B.
Young. “Development and Characterization of a TES Optical Imaging Array
for Astrophysics Applications,” Proceedings of 10th
International Workshop on Low Temperature Detectors, Genoa, Italy,
July 7-11, 2003.
K.E. Goodson, L. Jiang, S. Sinha, E. Pop, S. Im, D.
Fletcher, W. King, J.-M. Koo, E.N. Wang. “Microscale Thermal
Engineering of Electronics Systems,” Proceedings of Rohsenow Symposium on
Future Trends of Heat Transfer, Cambridge,
MA, May 16, 2003.
L. Jiang, J. Koo, A. Bari, E.N. Wang, L. Zhang, R.S.
Prasher, J.G. Maveety, T.W. Kenny, J.G. Santiago, K.E. Goodson. “Cross-Linked
Microchannels for VLSI Hotspot Cooling,” Proceedings of the ASME
International Mechanical Engineering Congress & Exposition, New
Orleans, LA, Nov. 17-22, 2002, MEMS-1, IMECE2002-39238.
J. Koo, S. Im, E. Cho, R.S. Prasher, E.N. Wang, L. Jiang, A.
Bari, D. Campion, D. Fogg, M. Kim, T.W. Kenny, J.G. Santiago, K.E. Goodson.
“VLSI Hotspot Cooling Using Two-Phase Microchannel Convection,” Proceedings
of the ASME International Mechanical Engineering Congress & Exposition,
New Orleans, LA, Nov. 17-22, 2002, PID-1A, IMECE2002-39585.
E.N. Wang, L. Zhang, L. Jiang, J.-M. Koo, J.G. Maveety, E.A.
Sanchez, K.E. Goodson, T.W. Kenny. “Micromachined Jet Arrays for Liquid
Impingement Cooling of VLSI Chips,” Proceedings of Hilton Head 2002:
Solid-State Sensors & Actuator Workshop, Hilton Head, SC, June 2-6,
2002.
J. Koo, L. Jiang, A. Bari, L. Zhang, E.N. Wang, T.W. Kenny,
J.G. Santiago, K.E. Goodson. “Convective Boiling in Microchannel Heat Sinks
with Spatially-Varying Heat Flux,” Proceedings of ITHERM, San Diego,
CA, May 30 - June 1, 2002, pp. 341-346.
L. Zhang, E.N. Wang, J.-M. Koo, L. Jiang, K.E. Goodson, J.G.
Santiago, T.W. Kenny. “Enhanced Nucleate Boiling in Microchannels,” Proceedings
of 15th IEEE MEMS Workshop, Las
Vegas, Nevada, Jan.
20-24, 2002.
L. Zhang, E.N. Wang, J.D. Koch, J.T. Liu, J.-M. Koo, L.
Jiang, K.E. Goodson, J.G. Santiago, T.W. Kenny. “Microscale Liquid
Impingement Cooling,” Proceedings of the ASME International Mechanical Engineering
Congress & Exposition, New York City, New York, Nov. 11-16, 2001.
E.N. Wang, M. Wojtowicz, D. Streit. “Traps in Pseudomorphic
Single and Double Heterostructure InGaAs/AlGaAs/GaAs HEMTs Measured by Deep
Level Current and Capacitance Transient Spectroscopy,” Electronic
Materials Conference, Santa
Barbara, CA, July
2, 1999.
A. Balandin, K.L.
Wang, S. Cai, R. Li, C.R. Viswanathan, E.N. Wang, M. Wojtowicz. “Correlation
Between Material Quality and Low-frequency Noise Level in GaN Heterostructure
Field Effect Transistors,” Electronic Materials Conference, Santa Barbara, CA,
July 1, 1999.
|