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PAPERS
- Kyungyoon
Noh, Nannaji Saka and Jung-Hoon Chun, Modeling Dielectric
Erosion in Multi-Step Copper Chemical-Mechancal Polishing, 204th Electrochemical
Society Meeting (Scheduled),
Oct. 12-17, 2003
- Kyungyoon
Noh, Nannaji Saka and Jung-Hoon Chun, A Mechanical Model for Erosion
In Copper Chemical Mechanical Polishing, Chemical-Mechanical
Planarization for ULSI Multilevel INterconnect Conference (CMP-MIC), p. 445,
2003
- Kwangduk
D. Lee, Nam P. Suh and Jae-Hyuk Oh, Axiomatic Design Machine Control
System, ASME journal of mechanical design (under review).
- Jiun-Yu
Lai, Nannaji Saka, and Jung-Hoon Chun, Evolution of Copper-Oxide Damascene
Structures in Chemical Polishing I, Journal of The Electrochemical
Society, Vol. 149, (no.1), p. G31-G40, 2002
- Jiun-Yu Lai,
Nannaji Saka, and Jung-Hoon Chun, Evolution of Copper-Oxide Damascene
Structures in Chemical Polishing II, Journal of The Electrochemical
Society, Vol. 149, (no.1), p. G41-G50, 2002
- Jason
Melvin and Hrishikesh Deo, Axiomatically Designed Robustness, American Supplier
Institute 19th Annual Taguchi Methods Symposium, 2002
- Jason
Melvin and Nam P. Suh, Beyond the Hierarchy: System-Wide
Rearangement as a Tool to Eliminate Iteration, Proceedings
of the Second International Conference on Axiomatic Design, M.I.T., June
10, 2002
- Jason Melvin
and Nam P. Suh, Axiomatic
Design of a CMP Wafer Carrier with Zoned Pressure Control, Proceeding
of IMECE, 2002
THESIS
- Jason Melvin, MS., PhD., "Axiomatic
System Design: Chemical Mechanical Polishing Machine Case Study" February
2003 - Total Thesis PDF (3MB)
- Jiun-Yu Lai, PhD. "Mechanics, Mechanisms, and Modeling
of the Chemical Mechanical Process" February 2001 - Total thesis PDF(12MB) or Abstract, AppendixA, AppendixB, Chapter 1, Chapter 2, Chapter 2.1, Chapter 3, Chapter 3.1, Chapter 4, Chapter 5, Chapter 5.1, Chapter 6, Chapter 6 old, Chapter 7, Chapter 8
- Jamie Nam, MS,
"Optical Endpoint Detection for the Chemical
Polishing Process" January 2000 - Total Thesis PDF (5MB)
- Amir
Torkaman, MS, "Design and Fabrication of a High
Precision Wafer Polishing Machine", January 2000.-
Total Thesis PDF (10MB)
PATENTS
- Nannaji
Saka, Jamie Nam and HIlario L. Oh
- Nannaji
Saka, Jamie Nam and HIlario L. Oh
- Jason
Melvin, Nam P. Suh, Hilario L. Oh
"Apparatus
and Method for Chemical-Mechanical Polishing of substrates"
(Patent
Pending)
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