Important OPTOCHIP Dates List of first offering participants
Important OPTOCHIP Dates
Date Milestone Apr. 1, 1996 Interim e-mail status report due Apr. 27, 1996 Final design files and documentation due May 1, 1996 Chip design submitted to MOSIS Jul. 15, 1996 IC chips received from MOSIS Oct. 15, 1996 Epitaxy and post-epi processing completed OEIC chips distributed to participating groups Dec. 31, 1996 Preliminary test report due Mar. 31, 1996 Final test report due
All of the groups submitting proposals were notified by November 15 of the outcome of the selection process, and those chosen to participate were given further information on the design tools and format to be used, detailed specifications of the optotelectronic and electronic devices available, and copies of the standard cell and other design files available at that time. They were given information on the other participants in the project, and urged to make contact with as many as possible.
The actual chip designs are being developed between December 1 and April 27, 1996, by the participating groups. It is anticipated that the participants (and organizers) will all be on pretty steep learning curves during the course of the OPTOCHIP Project, and communication between all parties involved will be essential to its success. A brief e-mail status reports on their design will be required from each group on April 1. These reports will be distributed to all OPTOCHIP participants to keep everyone informed on their colleagues' progress. The final design files, along with complete documentation (including SPICE simulations where appropriate), will be due on April 27, 1996.
The individual group design files will be combined into a single file for one multi-project chip approximately 7 mm on a side which will be submitted to MOSIS for the HGaAs3 run currently scheduled for May 1, 1996. A summary of the design will be distributed to all OPTOCHIP participants in May.
The turn around time for MOSIS run varies betwen 2 and 3 months, and the timetable allows for 2 1/2 months. Once the chips are received from MOSIS, they will be prepared for epitaxy in the MIT Microsystems Technology Laboratory (MTL), and the necessary InGaAs/GaAs LED heterostructures will be grown on them by gas source molecular beam epitaxy (GS-MBE) in the laboratory of Professor Leslie Kolodziejski at MIT. The post-epitaxy processing will then also be done in MTL. The LED and electronics functionality will be confirmed in Prof. Fonstad's laboratories at MIT, after which the multi-project chips will be cut into the individual project chips.
The objective will be to deliver six completed OEIC chips to each participating group by October 15, 1996. A preliminary e-mail report on the chips will be due at MIT by December 31, 1996, and a final written report (final at least for purposes of the initial OPTOCHIP offering) will be due March 31, 1997. The final reports will be combined and distributed to participants and other interested parties in spring 1997.