Objective

The objective of this symposium was open-ended discussion of current and future directions in heat transfer research. The symposium was built upon panel discussions by leading experts in heat transfer science and technology. Panels were held in four broad areas: phase-change heat transfer; advanced energy systems; heat transfer at the microscale and nanoscale; and heat transfer in electronics. Each panel included presentations on particular sub-areas, followed by comments from a respondent and from the audience.

This symposium was held in honor of Warren M. Rohsenow on the occasion of the tenth anniversary of the naming of the MIT Heat and Mass Transfer Laboratory for him.

Technical Papers

Phase-change heat transfer

• Phase change heat transfer --- A perspective for the future
  V.K. Dhir, UCLA
• Phase change heat transfer: Response to Professor V.K. Dhir
  C.T. Avedisian, Cornell
  
• High-flux processes through enhanced heat transfer
  A.E. Bergles, MIT
• Boiling enhancement: Response to Professor A.E. Bergles
  G.F. Hewitt, Imperial College
  

Advanced energy systems

• Advanced nuclear energy systems: Heat transfer issues and trends
  M.L. Corradini, Wisconsin
  (accompanying presentation)
• Hydrogen futures and technologies
  C.W. Forsberg, ORNL
  (accompanying presentation)
• Improving energy efficiency 2-3%/year to save money and avoid global warming
  A.H. Rosenfeld, California Energy Commission
  
• Comments on papers: Session on advanced energy systems
  J.M. Deutch, MIT

Heat transfer at small dimensions

• Microscale thermal engineering of electronic systems
  K.E. Goodson, Stanford; et al.
  (accompanying presentation)
• Nanoscale heat transfer and information technology
  G. Chen, MIT
  (accompanying presentation)
• Nanoscale transport phenomena at the interface of hard and soft matter
  A. Majumdar, UC Berkeley
  
• Nanostructures and energy conversion
  M.S. Dresselhaus, MIT
  (accompanying presentation)

Electronics thermal management

• Thermal management roadmap: Cooling electronic products from hand-held devices to supercomputers
  R.C. Chu, IBM; et al.
• Thermal management of electronics: Energy conversion issues
  A. Bar-Cohen, Maryland
• MEMS-based thermal management of high heat flux devices edifice: Embedded droplet impingement for integrated cooling of electronics
  C.H. Amon, CMU
  
• Thermal control of electronics: Perspectives and prospects
  R.J. Hannemann | Charlespoint Group
  (accompanying presentation)

Extras!

• The upper limit of thermocouple use and the lower limit for line reversal method used to measure temperature
  J.P. Hartnett, W.C. Fuller, and W.M. Rohsenow, MIT
• A History of the MIT Heat Transfer Lab
  J.H. Lienhard V, MIT
• List of Heat Transfer Laboratory Reports
  A.E. Bergles, MIT