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Publications
     
 
To date, SMA Fellows have published 366 articles in 289 journals while 51 articles have been accepted for publication in 43 journals. Some articles are listed under more than one category.
 
     
 

AMM&NS Programme

 
     
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  Collaborative Research Projects with SMA-MIT Fellows  
     
 

Carbon Nanotubes

Journal Publication

Krishnan R., Nguyen H. Q., Thompson C. V., Choi W. K. & Foo Y. L., “Wafer-Level Ordered Arrays of Aligned Carbon Nanotubes with Controlled Size and Spacing on Silicon”, Nanotechnology (accepted).

Copper Reliability

Journal Publications

  1. Gan C. L., Thompson C. V., Pey K. L., Choi W. K., Tay H. L., Yu B. & Radhakrishnan M. K., “Effect of Current Direction on the Lifetime of Different Levels of Cu Dual-Damascene Metallization”, Applied Physics Letters, Vol. 79, pp. 4592 (2001).

  2. Gan C. L., Thompson C. V., Pey K. L. & Choi W. K., “Experimental Characterization and Modeling of the Reliability of 3-Terminal Dual-Damascene Cu Interconnect Trees”, Journal of Applied Physics, Vol. 94, No. 2, pp. 1222-1228 (2003).

Conference Publications

  1. Gan C. L., Thompson C. V., Pey K. L., Choi W. K., Wei F., Yu B. & Hau-Riege S. P., “Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Tress”, Proceedings of MRS Spring 2002 Meeting.

  2. Wei F., Gan C. L., Thompson C. V., Clement J. J., Hau-Riege S. P., Pey K. L., Choi W. K., Tay H. L., Yu B. & Radhakrishnan M. K., “Length Effects on the Reliability of Dual-Damascene Cu Interconnects”, Proceedings of MRS Spring 2002 Meeting.

  3. Gan C. L., Wei F., Thompson C. V., Pey K. L., Choi W. K. & Yu B., “Consequence of Preferential Void Formation at the Cu/Si3N4 Interface on the Multiple Failure Mechanisms of Cu Dual-Damascene Metallization”, presented at IPFA2002.

  4. Gan C. L., Thompson C. V., Pey K. L., Choi W. K., Chang C. W. & Guo Q., “Effect of Current Direction on the Reliability of Multi-Terminal Cu Dual-Damascene Interconnect Trees”, Proceedings of IEEE IRPS2003, pp. 594-595.

  5. Gan C. L., Wei F., Thompson C. V., Pey K. L., Choi W. K., Hau-Riege S. P. & Yu B., “Contrasting Failure Characteristics of Different Levels of Cu Dual-Damascene Metallization”, 2002 European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Rimini, Italy, 9 October 2002.

  6. Gan C. L., Thompson C. V., Pey K. L., Choi W. K., Chang C. W. & Guo Q.,“Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees”, MRS 2003, Vol. 766.

  7. Chang C. W., Gan C. L., Thompson C. V., Pey K. L. & Choi W. K, “Observation of Joule-Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO2 Interconnects”, Proceedings of IEEE IPFA2003, pp. 69-74.

  8. Chang C. W., Gan C. L., Thompson C. V., Pey K. L., Choi W. K. & Hwang N. “Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segment”, presented at MRS’04 Spring Meeting, 13-15 April 2004. Proceeding MRS Spring meeting, pp. F7.2.1-F7.2.6, 2004

  9. Choi Z. S., Gan C. L., Wei F., Thompson C. V., Lee J. H., Pey K. L. & Choi W. K., “Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects”, presented at MRS’04 Spring meeting, April 2004, USA. Proceeding MRS Spring meeting, F7.6.1-F7.6.6, 2004.

GaN on Si

Journal Publications

  1. Wang L. S., Zang K. Y., Tripathy S. & Chua S. J., “Effects of Periodic Delta-Doping on the Properties of GaN:Si Films Grown on Si (111) Substrate”, Applied Physics Letters, Vol. 85, No. 24, pp. 5881-5883 (2004).

  2. Zang K. Y., Wang L. S., Chua S. J. & Thompson C. V., “Structural Analysis of Metalorganic Chemical Vapor Deposited AlN Nucleation Layers on Si(111)”, Journal Crystal Growth, Vol. 268, No. 3-4, pp. 515-520 (2004).

GaN Nanostructures

Journal Publication

Wang Y. D., Chua S. J., Sander M. S., Chen P., Tripathy S. & Fonstad C. G.,“Fabrication and Properties of Nanoporous GaN Films”, Applied Physics Letters, Vol. 8, No. 5, pp. 816-818 (2004).

 
     
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