Machines by Location: 4F Bonding
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
TRL | EV501 | Photo | Bond | Bonder system to apply heat, vacuum and pressure | ||
TRL | EV620 | Photo | Bond | Aligner for bonding | ||
TRL | nanospec | Metrology | Thickness | Thin film thickness measurement | ||
TRL | TBM-8 | Photo | Bond | Front-to-back alignement measurement |