Machines by Process Category: Deposition
For CVD deposition, many tools can deposit very similar films. Here, the materials and process history of your samples may be important in choosing the right tool. One such choice is between the concept1 and the DCVD. The DCVD is more restrictive in the sample history than the concept1. Another example is the choice between the eBeamAu and eBeamFP, which both process RED TRL samples - the eBeamFP has faster pump down due to a fixed set of 6 materials (including Pt and Au), while the eBeamAu may be slower but offers greater material flexibility.
Deposition rates, film quality (e.g. residual gases and film porosity), and tool-specific thickness limitations may also be a concern. Thick films can peel due to stress, and evaporation of thick layers (e.g. over 500 nm) may also result in problems with the crucible in evaporators. Sputtering may be slow (in the AJA-TRL) or fast (in the endura but which required GREEN processes).
Process | Lab | Tool | Subcategory | Description | |
---|---|---|---|---|---|
EML | ALD-EML | CVD | Atomic Layer Deposition | ||
EML | BalzerSputterer | Sputter | Thin sputter coating of samples | ||
EML | eBeam-AJA | Evaporate | Metal and dielectric evaporator | ||
EML | plasmatherm | PECVD, RIE | Plasma Etch and Deposition | ||
EML | SputtererAJA | Sputter | Sputter deposition tool | ||
ICL | ALD | CVD | Atomic Layer Deposition | ||
ICL | ALD-Oxford | CVD, PECVD | Atomic Layer Deposition | ||
ICL | concept1 | PECVD | PECVD deposition of oxides, nitrides, and TEOS | ||
ICL | DCVD | PECVD | PECVD deposition of oxides, nitrides, and a-Si | ||
ICL | eBeam-EVO | Evaporate | Metal evaporator of CMOS compatible metals | ||
ICL | endura | Sputter | Metal sputter deposition | ||
ICL | epi-Centura | CVD | Not open to public | ||
ICL | Oxford-100_PECVD | PECVD | Dual chamber PECVD and plasma etch tool | ||
ICL | Oxford-100_Etch | RIE | Dual chamber PECVD and plasma etch tool | ||
TRL | AJA-TRL | Sputter | Sputter deposition tool | ||
TRL | Balzer-Elionix | Sputter | SEM or EBL sample preparation | ||
TRL | CCNT | PECVD | Carbon nanotube growth | ||
TRL | eBeamAu | Evaporate | Metal evaporator | ||
TRL | eBeamFP | Evaporate | Fast pumping metal evaporator | ||
TRL | parylene | CVD | Parylene depopsition | ||
TRL | PZTcoater | Spin-Coat | Coater to apply PZT films | ||
TRL | PZTfurnace | Bake | Bake oven for PZT coated wafers | ||
TRL | sts-CVD | PECVD | PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si |