Equipment
| Lab and Coral Name | EML / plasmatherm |
| Model | Plasmatherm |
| Specialist | Kurt Broderick (Timothy Turner, Gary Riggott) |
| Physical Location | 5F 3-South Packaging |
Classification
| Process Category | Deposition, Etch |
| Subcategory | PECVD, RIE |
| Material Keywords | Silicon, III-V, GaN, SiO2, SiNx, Dielectrics, CMOS Metals, Non-CMOS Metals, Non-Standard Materials, 2D Materials |
| Sample Size | 6" Wafers, 4" Wafers, Pieces |
| Alternative | ? |
| Keywords | single wafer, load lock, top side of sample, isotropic etch, conformal dep, vacuum, plasma, temperature |
Description
The plasmatherm is a dual chamber PECVD-RIE that etches & deposits dielectrics; heated chuck
| Best for | General purpose etch and deposition |
| Limitations | |
| Characteristics/FOM | Cl2, BCl3, SF6, CF4, CHF3 RIE A-Si, SiO2, SiN PECVD |
| Caution with | |
| Machine Charges | 7/wafer + 1/um |
Documents
SOP
| Plasmatherm | SOP for the plasmatherm |
Process Matrix Details
PTC Matrix does not apply for EML
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL