Machines by Material Keyword: Silicon
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
EML | acid-hood-EML | Wet | Solvents | General Purpose Acid Fume-Hood | ||
EML | OxidationTube | Diffusion | Oxidation | Oxidation Furnace | ||
EML | plasmatherm | Deposition, Etch | PECVD, RIE | Plasma Etch and Deposition | ||
ICL | 6A-nPoly | Diffusion | CVD | Polysilicon deposition tube for n-type poly Si | ||
ICL | 6B-Poly | Diffusion | CVD | Polysilicon deposition tube for p-type poly Si | ||
ICL | AME5000 | Etch | RIE | RIE etcher for frontend silicon processes | ||
ICL | DCVD | Deposition | PECVD | PECVD deposition of oxides, nitrides, and a-Si | ||
ICL | diesaw | Packaging | Physical | Wafer dicing saw | ||
ICL | diesaw-3240 | Packaging | Physical | Wafer dicing saw | ||
ICL | epi-Centura | Deposition | CVD | Not open to public | ||
ICL | GnP | Wet | Other | Chemical Mechanical Polishing to planarize surfaces | ||
ICL | LAM490B | Etch | RIE | Chlorine based plasma etching of silicon | ||
ICL | rca-ICL | Diffusion | Clean | Wafer cleaning before diffusion tubes | ||
ICL | RTA2 | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTA-pieces | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTP | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTP-Si | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | SM-300 | Metrology | Thickness | Thickness measurement for CMP processing | ||
ICL | TMAH-KOHhood | Wet | Acids | Silicon bulk wet etching | ||
MTL | Procedures-Cleaning | Procedures | Clean | Sample Cleaning | ||
MTL | Procedures-Etching | Procedures | Etch | Etching of materials | ||
MTL | Procedures-Metrology | Procedures | Metrology | Test and Measurement | ||
TRL | acid-hood | Wet | Acids | Acid processing station | ||
TRL | B2-Ox-alloy-Poly | Diffusion | Oxidation | Thermal Oxidation and LPCVD Polysilicon for RED wafers | ||
TRL | B4-Poly | Diffusion | CVD | LPCVD polysilicon for Green wafers | ||
TRL | develop-Brewer | Photo | Coat | Resist develop and postbake | ||
TRL | EV501 | Photo | Bond | Bonder system to apply heat, vacuum and pressure | ||
TRL | EV620 | Photo | Bond | Aligner for bonding | ||
TRL | Greenflo | Wet | Acids | Acid processing station | ||
TRL | HMDS-TRL | Photo | Bake | HMDS oven | ||
TRL | plasmaquest | Etch | RIE | Fluorine and Chlorine general purpose plasma deposition and etch tool | ||
TRL | Resonetics | Photo | Expose | Laser ablation system | ||
TRL | RTA-HiT | Diffusion | Bake | Rapid Thermal Annealing | ||
TRL | sts1 | Etch | DRIE | Deep reactive ion etcher for silicon | ||
TRL | sts2 | Etch | DRIE | Deep reactive ion etcher for silicon | ||
TRL | sts-CVD | Deposition | PECVD | PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si | ||
TRL | sts-Pegasus | Etch | DRIE | Deep reactive ion etcher for silicon | ||
TRL | XeF2 | Etch | RIE | XeF2 isotropic etching of silicon |