+ | EML |
acid-hood-EML
| Wet | Solvents
| General Purpose Acid Fume-Hood
| EML
|
+ | EML |
OxidationTube
| Diffusion | Oxidation
| Oxidation Furnace
| EML
|
+ | EML |
plasmatherm
| Deposition, Etch | PECVD, RIE
| Plasma Etch and Deposition
| EML
|
+ | ICL |
6A-nPoly
| Diffusion | CVD
| Polysilicon deposition tube for n-type poly Si
| Green
|
+ | ICL |
6B-Poly
| Diffusion | CVD
| Polysilicon deposition tube for p-type poly Si
| Green
|
+ | ICL |
AME5000
| Etch | RIE
| RIE etcher for frontend silicon processes
| Green
|
+ | ICL |
DCVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
diesaw
| Packaging | Physical
| Wafer dicing saw
| Red
|
+ | ICL |
diesaw-3240
| Packaging | Physical
| Wafer dicing saw
| Red
|
+ | ICL |
epi-Centura
| Deposition | CVD
| Not open to public
| Green
|
+ | ICL |
GnP
| Wet | Other
| Chemical Mechanical Polishing to planarize surfaces
| Red &Green
|
+ | ICL |
LAM490B
| Etch | RIE
| Chlorine based plasma etching of silicon
| Green
|
+ | ICL |
rca-ICL
| Diffusion | Clean
| Wafer cleaning before diffusion tubes
| Green
|
+ | ICL |
RTA2
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTA-pieces
| Diffusion | Bake
| Rapid Thermal Annealing
| Red
|
+ | ICL |
RTP
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTP-Si
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
SM-300
| Metrology | Thickness
| Thickness measurement for CMP processing
| Red &Green
|
+ | ICL |
TMAH-KOHhood
| Wet | Acids
| Silicon bulk wet etching
| Red &Green
|
| MTL |
Procedures-Cleaning
| Procedures | Clean
| Sample Cleaning
| Red &Green
|
| MTL |
Procedures-Etching
| Procedures | Etch
| Etching of materials
| Red &Green
|
| MTL |
Procedures-Metrology
| Procedures | Metrology
| Test and Measurement
| Red &Green
|
+ | TRL |
acid-hood
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
B2-Ox-alloy-Poly
| Diffusion | Oxidation
| Thermal Oxidation and LPCVD Polysilicon for RED wafers
| Green
|
+ | TRL |
B4-Poly
| Diffusion | CVD
| LPCVD polysilicon for Green wafers
| Green
|
+ | TRL |
develop-Brewer
| Photo | Coat
| Resist develop and postbake
| Red &Green
|
+ | TRL |
EV501
| Photo | Bond
| Bonder system to apply heat, vacuum and pressure
| Red &Green
|
+ | TRL |
EV620
| Photo | Bond
| Aligner for bonding
| Red &Green
|
+ | TRL |
Greenflo
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
HMDS-TRL
| Photo | Bake
| HMDS oven
| Red &Green
|
+ | TRL |
plasmaquest
| Etch | RIE
| Fluorine and Chlorine general purpose plasma deposition and etch tool
| Red
|
+ | TRL |
Resonetics
| Photo | Expose
| Laser ablation system
| Red
|
+ | TRL |
RTA-HiT
| Diffusion | Bake
| Rapid Thermal Annealing
| Red
|
+ | TRL |
sts1
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
sts2
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Green
|
+ | TRL |
sts-CVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|
+ | TRL |
sts-Pegasus
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
XeF2
| Etch | RIE
| XeF2 isotropic etching of silicon
| Red
|