Machines by Material Keyword: Silicon
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| EML | acid-hood-EML | Wet | Solvents | General Purpose Acid Fume-Hood | ||
| EML | OxidationTube | Diffusion | Oxidation | Oxidation Furnace | ||
| EML | plasmatherm | Deposition, Etch | PECVD, RIE | Plasma Etch and Deposition | ||
| ICL | 6A-nPoly | Diffusion | CVD | Polysilicon deposition tube for n-type poly Si | ||
| ICL | 6B-Poly | Diffusion | CVD | Polysilicon deposition tube for p-type poly Si | ||
| ICL | AME5000 | Etch | RIE | RIE etcher for frontend silicon processes | ||
| ICL | DCVD | Deposition | PECVD | PECVD deposition of oxides, nitrides, and a-Si | ||
| ICL | diesaw | Packaging | Physical | Wafer dicing saw | ||
| ICL | diesaw-3240 | Packaging | Physical | Wafer dicing saw | ||
| ICL | epi-Centura | Deposition | CVD | Not open to public | ||
| ICL | GnP | Wet | Other | Chemical Mechanical Polishing to planarize surfaces | ||
| ICL | LAM490B | Etch | RIE | Chlorine based plasma etching of silicon | ||
| ICL | rca-ICL | Diffusion | Clean | Wafer cleaning before diffusion tubes | ||
| ICL | RTA2 | Diffusion | Bake | Rapid Thermal Annealing | ||
| ICL | RTA-pieces | Diffusion | Bake | Rapid Thermal Annealing | ||
| ICL | RTP | Diffusion | Bake | Rapid Thermal Annealing | ||
| ICL | RTP-Si | Diffusion | Bake | Rapid Thermal Annealing | ||
| ICL | SM-300 | Metrology | Thickness | Thickness measurement for CMP processing | ||
| ICL | TMAH-KOHhood | Wet | Acids | Silicon bulk wet etching | ||
| MTL | Procedures-Cleaning | Procedures | Clean | Sample Cleaning | ||
| MTL | Procedures-Etching | Procedures | Etch | Etching of materials | ||
| MTL | Procedures-Metrology | Procedures | Metrology | Test and Measurement | ||
| TRL | acid-hood | Wet | Acids | Acid processing station | ||
| TRL | B2-Ox-alloy-Poly | Diffusion | Oxidation | Thermal Oxidation and LPCVD Polysilicon for RED wafers | ||
| TRL | B4-Poly | Diffusion | CVD | LPCVD polysilicon for Green wafers | ||
| TRL | develop-Brewer | Photo | Coat | Resist develop and postbake | ||
| TRL | EV501 | Photo | Bond | Bonder system to apply heat, vacuum and pressure | ||
| TRL | EV620 | Photo | Bond | Aligner for bonding | ||
| TRL | Greenflo | Wet | Acids | Acid processing station | ||
| TRL | HMDS-TRL | Photo | Bake | HMDS oven | ||
| TRL | plasmaquest | Etch | RIE | Fluorine and Chlorine general purpose plasma deposition and etch tool | ||
| TRL | Resonetics | Photo | Expose | Laser ablation system | ||
| TRL | RTA-HiT | Diffusion | Bake | Rapid Thermal Annealing | ||
| TRL | sts1 | Etch | DRIE | Deep reactive ion etcher for silicon | ||
| TRL | sts2 | Etch | DRIE | Deep reactive ion etcher for silicon | ||
| TRL | sts-CVD | Deposition | PECVD | PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si | ||
| TRL | sts-Pegasus | Etch | DRIE | Deep reactive ion etcher for silicon | ||
| TRL | XeF2 | Etch | RIE | XeF2 isotropic etching of silicon |