The material keywords help to identify which materials a tool is primarily processing. That is, the tool is either "acting upon" or "depositing" the particular material. For example, "silicon" can be deposited in the DCVD as amorphous-silicon, or etched in the sts1. On the other hand, the eBeamFP is a metal deposition tool, and while it can take "silicon" wafers, it does neither act on the silicon nor deposit it, so it's not a material keyword. The point here is to recognize that material keywords don't equate to "this material can go into the tool". Similarly, the main purpose of the tool must be related to that material. For example, the sts1 is a DRIE etcher, and while it does have oxygen and can in principle ash samples, this is not its purpose. So "photoresist" is not a material keyword, even though the tool can be abused into ashing samples.

Attribute	Description	Tool List
2D Materials	Any transfer-deposited 2-D material (graphene, MoS2, etc)	acid-hood-EML,plasmatherm,SolventHood-EML,Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,acid-hood,CCNT,Greenflo,plasmaquest,SAMCO,
Acids	Acids or other corrosive chemicals that require personal protective equipment	acid-hood-EML,2Dtransfer-platingHood,nitrEtch-HotPhos,oxEtch-BOE,premetal-Piranha,rca-ICL,TMAH-KOHhood,Procedures-Etching,acid-hood,Greenflo,rca-TRL,
CMOS Metals	Metals that are compatible with CMOS devices	acid-hood-EML,ALD-EML,anneal-furnace,Box-Furnace,eBeam-AJA,parametric-tester,plasmatherm,RTA-EML,SputtererAJA,2Dtransfer-platingHood,4-pt-probe,5B-Anneal,ALD,ALD-Oxford,pTrack,cv,eBeam-EVO,endura,GnP,goldwire,Oxford-100_PECVD,Oxford-100_Etch,rainbow,RTA2,RTA-pieces,RTP,RTP-Si,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,AJA-TRL,eBeamAu,eBeamFP,Greenflo,Hall-probe,IV-probe,plasmaquest,Resonetics,RTA-HiT,SAMCO,AutoBonder,BallBonder,WedgeBonder,
Developer	Photoresist developers, either aqueous or solvent based	photo-hood-EML,pTrack,Procedures-Lithography,develop-Brewer,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,
Dielectrics	Dielectric films	acid-hood-EML,ALD-EML,anneal-furnace,Box-Furnace,filmetrics,OxidationTube,plasmatherm,RTA-EML,SputtererAJA,5B-Anneal,ALD,ALD-Oxford,AME5000,concept1,GnP,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,UV1280,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,AJA-TRL,eBeamAu,ellipsometer-TRL,Filmetrics-TRL,Greenflo,LAM590-TRL,nanospec,plasmaquest,sts-CVD,
EBL Resist	Resists sensitive for electron beam lithography	Elionix,acid-hood-EML,asher-EML,coater-EML,eBeam-AJA,filmetrics,photo-hood-EML,SolventHood-EML,asher-ICL,eBeam-EVO,premetal-Piranha,UV1280,Procedures-Cleaning,Procedures-General,Procedures-Lithography,asherMatrix-TRL,asher-TRL,coater,eBeamAu,eBeamFP,ellipsometer-TRL,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,nanospec,photo-wet-Au,photo-wet-l,photo-wet-r,PMMAspinner,SolventHood-TRL,varTemp,
GaN	Gallium Nitride	acid-hood-EML,plasmatherm,diesaw,diesaw-3240,GnP,rainbow,SM-300,Procedures-Cleaning,Procedures-Etching,Procedures-Metrology,A4-III-Vanneal,acid-hood,develop-Brewer,Greenflo,plasmaquest,RTA-HiT,SAMCO,
III-V	Any compound semiconductor	acid-hood-EML,plasmatherm,diesaw,diesaw-3240,SM-300,Procedures-Cleaning,Procedures-Etching,Procedures-Metrology,A4-III-Vanneal,acid-hood,develop-Brewer,Greenflo,plasmaquest,RTA-HiT,SAMCO,
Non-CMOS Metals	Metals that are not CMOS compatible and contaminate Si based devices	acid-hood-EML,anneal-furnace,BalzerSputterer,Box-Furnace,eBeam-AJA,parametric-tester,plasmatherm,RTA-EML,SputtererAJA,2Dtransfer-platingHood,4-pt-probe,cv,GnP,goldwire,Oxford-100_PECVD,Oxford-100_Etch,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,AJA-TRL,Balzer-Elionix,eBeamAu,eBeamFP,Greenflo,Hall-probe,IV-probe,plasmaquest,Resonetics,RTA-HiT,SAMCO,AutoBonder,BallBonder,WedgeBonder,
None	No specific material interaction	dektak-EML,semNeo,vac-oven,AFM,P10,semZeiss,wykoICL,B1-Au,dek-NoAu,dektak-XT,FLX,SU8oven,TBM-8,WYKO,X-rayInspection,DieBonder,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,OutsideLab,CNS,NSL,SNL,
Non-Standard Materials	Any non-standard semiconductor processing materials, often requiring special precautions	acid-hood-EML,ALD-EML,anneal-furnace,Box-Furnace,eBeam-AJA,filmetrics,OxidationTube,plasmatherm,RTA-EML,SolventHood-EML,SputtererAJA,ALD,ALD-Oxford,Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A4-III-Vanneal,acid-hood,AJA-TRL,asher-TRL,CCNT,eBeamAu,ellipsometer-TRL,Filmetrics-TRL,Greenflo,nanospec,parylene,plasmaquest,PZTcoater,PZTfurnace,
Other Polymers	Any other (usually non-standard) polymer material	acid-hood-EML,asher-EML,coater-EML,filmetrics,hotpress,MA-4,photo-hood-EML,SolventHood-EML,i-stepper,Oxford-100_PECVD,Oxford-100_Etch,Procedures-Cleaning,Procedures-Lithography,coater,ellipsometer-TRL,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,postbake,prebakeovn,Resonetics,SolventHood-TRL,UVozone-Au,varTemp,
Photoresist	UV light sensitive photoresists for contact and stepper lithography	acid-hood-EML,asher-EML,coater-EML,eBeam-AJA,filmetrics,MA-4,photo-hood-EML,SolventHood-EML,asher-ICL,pTrack,eBeam-EVO,i-stepper,premetal-Piranha,UV1280,Procedures-Cleaning,Procedures-General,Procedures-Lithography,acid-hood,asherMatrix-TRL,asher-TRL,coater,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,EV1,EV-LC,Filmetrics-TRL,Greenflo,Heidelberg,hotplate1,hotplate2,hotplate300,MA-6,MLA-150,nanospec,OAI-Flood,photo-wet-Au,photo-wet-l,photo-wet-r,PMMAspinner,postbake,prebakeovn,Resonetics,SolventHood-TRL,varTemp,
Polyimide	Cleanroom compatible polyimide (photosensitive or not)	acid-hood-EML,asher-EML,coater-EML,filmetrics,MA-4,photo-hood-EML,SolventHood-EML,i-stepper,UV1280,Procedures-Cleaning,Procedures-Lithography,coater,ellipsometer-TRL,EV1,EV-LC,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,MA-6,nanospec,OAI-Flood,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,Resonetics,SolventHood-TRL,varTemp,
Pyrex	Pyrex glass, and therefore sodium contaminated	acid-hood-EML,diesaw,diesaw-3240,Procedures-Etching,Procedures-Metrology,acid-hood,develop-Brewer,EV501,EV620,Greenflo,
Quartz	Quartz, and therefore sodium free	acid-hood-EML,diesaw,diesaw-3240,Procedures-Etching,Procedures-Metrology,acid-hood,develop-Brewer,Greenflo,
Silicon	Silicon or polysilicon, as part of the wafer or deposited	acid-hood-EML,OxidationTube,plasmatherm,6A-nPoly,6B-Poly,AME5000,DCVD,diesaw,diesaw-3240,epi-Centura,GnP,LAM490B,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,SM-300,TMAH-KOHhood,Procedures-Cleaning,Procedures-Etching,Procedures-Metrology,acid-hood,B2-Ox-alloy-Poly,B4-Poly,develop-Brewer,EV501,EV620,Greenflo,HMDS-TRL,plasmaquest,Resonetics,RTA-HiT,sts1,sts2,sts-CVD,sts-Pegasus,XeF2,
SiNx	Silicon nitride, stoichiometric or deposited	acid-hood-EML,anneal-furnace,Box-Furnace,filmetrics,plasmatherm,RTA-EML,5B-Anneal,6D-Nitride,AME5000,concept1,DCVD,GnP,LAM490B,LAM590-ICL,nitrEtch-HotPhos,Oxford-100_PECVD,Oxford-100_Etch,UV1280,VTR,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,ellipsometer-TRL,Filmetrics-TRL,Greenflo,HMDS-TRL,LAM590-TRL,nanospec,plasmaquest,sts1,sts2,sts-CVD,sts-Pegasus,
SiO2	Silicon dioxide, thermally grown or deposited	acid-hood-EML,anneal-furnace,Box-Furnace,filmetrics,OxidationTube,plasmatherm,RTA-EML,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6C-LTO,AME5000,concept1,DCVD,GnP,LAM490B,LAM590-ICL,oxEtch-BOE,Oxford-100_PECVD,Oxford-100_Etch,rca-ICL,UV1280,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A1-GateOx,A2-WetOxBond,A3-Sinter,acid-hood,B2-Ox-alloy-Poly,B3-DryOx,ellipsometer-TRL,Filmetrics-TRL,Greenflo,HMDS-TRL,LAM590-TRL,nanospec,plasmaquest,sts-CVD,
Solvents	Cleanroom solvents	photo-hood-EML,SolventHood-EML,Procedures-Cleaning,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,
SU8	Cleanroom SU8 polymers (photosensitive or not)	acid-hood-EML,coater-EML,filmetrics,MA-4,photo-hood-EML,Procedures-Cleaning,Procedures-Lithography,ellipsometer-TRL,EV1,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,nanospec,OAI-Flood,Resonetics,SU8spinner,

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