The material keywords help to identify which materials a tool is primarily processing. That is, the tool is either "acting upon"
or "depositing" the particular material. For example, "silicon" can be deposited in the DCVD as amorphous-silicon, or
etched in the sts1. On the other hand, the eBeamFP is a metal deposition tool, and while it can take "silicon" wafers, it does
neither act on the silicon nor deposit it, so it's not a material keyword. The point here is to recognize that material
keywords don't equate to "this material can go into the tool". Similarly, the main purpose of the tool must be related
to that material. For example, the sts1 is a DRIE etcher, and while it does have oxygen and can in principle ash samples, this is
not its purpose. So "photoresist" is not a material keyword, even though the tool can be abused into ashing samples.
| Attribute | Description | Tool List |
| 2D Materials
| Any transfer-deposited 2-D material (graphene, MoS2, etc)
| acid-hood-EML,plasmatherm,SolventHood-EML,Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,acid-hood,CCNT,Greenflo,plasmaquest,SAMCO,
|
| Acids
| Acids or other corrosive chemicals that require personal protective equipment
| acid-hood-EML,2Dtransfer-platingHood,nitrEtch-HotPhos,oxEtch-BOE,premetal-Piranha,rca-ICL,TMAH-KOHhood,Procedures-Etching,acid-hood,Greenflo,rca-TRL,
|
| CMOS Metals
| Metals that are compatible with CMOS devices
| acid-hood-EML,ALD-EML,anneal-furnace,Box-Furnace,eBeam-AJA,parametric-tester,plasmatherm,RTA-EML,SputtererAJA,2Dtransfer-platingHood,4-pt-probe,5B-Anneal,ALD,ALD-Oxford,pTrack,cv,eBeam-EVO,endura,GnP,goldwire,Oxford-100_PECVD,Oxford-100_Etch,rainbow,RTA2,RTA-pieces,RTP,RTP-Si,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,AJA-TRL,eBeamAu,eBeamFP,Greenflo,Hall-probe,IV-probe,plasmaquest,Resonetics,RTA-HiT,SAMCO,AutoBonder,BallBonder,WedgeBonder,
|
| Developer
| Photoresist developers, either aqueous or solvent based
| photo-hood-EML,pTrack,Procedures-Lithography,develop-Brewer,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,
|
| Dielectrics
| Dielectric films
| acid-hood-EML,ALD-EML,anneal-furnace,Box-Furnace,filmetrics,OxidationTube,plasmatherm,RTA-EML,SputtererAJA,5B-Anneal,ALD,ALD-Oxford,AME5000,concept1,GnP,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,UV1280,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,AJA-TRL,eBeamAu,ellipsometer-TRL,Filmetrics-TRL,Greenflo,LAM590-TRL,nanospec,plasmaquest,sts-CVD,
|
| EBL Resist
| Resists sensitive for electron beam lithography
| Elionix,acid-hood-EML,asher-EML,coater-EML,eBeam-AJA,filmetrics,photo-hood-EML,SolventHood-EML,asher-ICL,eBeam-EVO,premetal-Piranha,UV1280,Procedures-Cleaning,Procedures-General,Procedures-Lithography,asherMatrix-TRL,asher-TRL,coater,eBeamAu,eBeamFP,ellipsometer-TRL,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,nanospec,photo-wet-Au,photo-wet-l,photo-wet-r,PMMAspinner,SolventHood-TRL,varTemp,
|
| GaN
| Gallium Nitride
| acid-hood-EML,plasmatherm,diesaw,diesaw-3240,GnP,rainbow,SM-300,Procedures-Cleaning,Procedures-Etching,Procedures-Metrology,A4-III-Vanneal,acid-hood,develop-Brewer,Greenflo,plasmaquest,RTA-HiT,SAMCO,
|
| III-V
| Any compound semiconductor
| acid-hood-EML,plasmatherm,diesaw,diesaw-3240,SM-300,Procedures-Cleaning,Procedures-Etching,Procedures-Metrology,A4-III-Vanneal,acid-hood,develop-Brewer,Greenflo,plasmaquest,RTA-HiT,SAMCO,
|
| Non-CMOS Metals
| Metals that are not CMOS compatible and contaminate Si based devices
| acid-hood-EML,anneal-furnace,BalzerSputterer,Box-Furnace,eBeam-AJA,parametric-tester,plasmatherm,RTA-EML,SputtererAJA,2Dtransfer-platingHood,4-pt-probe,cv,GnP,goldwire,Oxford-100_PECVD,Oxford-100_Etch,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,AJA-TRL,Balzer-Elionix,eBeamAu,eBeamFP,Greenflo,Hall-probe,IV-probe,plasmaquest,Resonetics,RTA-HiT,SAMCO,AutoBonder,BallBonder,WedgeBonder,
|
| None
| No specific material interaction
| dektak-EML,semNeo,vac-oven,AFM,P10,semZeiss,wykoICL,B1-Au,dek-NoAu,dektak-XT,FLX,SU8oven,TBM-8,WYKO,X-rayInspection,DieBonder,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,OutsideLab,CNS,NSL,SNL,
|
| Non-Standard Materials
| Any non-standard semiconductor processing materials, often requiring special precautions
| acid-hood-EML,ALD-EML,anneal-furnace,Box-Furnace,eBeam-AJA,filmetrics,OxidationTube,plasmatherm,RTA-EML,SolventHood-EML,SputtererAJA,ALD,ALD-Oxford,Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A4-III-Vanneal,acid-hood,AJA-TRL,asher-TRL,CCNT,eBeamAu,ellipsometer-TRL,Filmetrics-TRL,Greenflo,nanospec,parylene,plasmaquest,PZTcoater,PZTfurnace,
|
| Other Polymers
| Any other (usually non-standard) polymer material
| acid-hood-EML,asher-EML,coater-EML,filmetrics,hotpress,MA-4,photo-hood-EML,SolventHood-EML,i-stepper,Oxford-100_PECVD,Oxford-100_Etch,Procedures-Cleaning,Procedures-Lithography,coater,ellipsometer-TRL,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,postbake,prebakeovn,Resonetics,SolventHood-TRL,UVozone-Au,varTemp,
|
| Photoresist
| UV light sensitive photoresists for contact and stepper lithography
| acid-hood-EML,asher-EML,coater-EML,eBeam-AJA,filmetrics,MA-4,photo-hood-EML,SolventHood-EML,asher-ICL,pTrack,eBeam-EVO,i-stepper,premetal-Piranha,UV1280,Procedures-Cleaning,Procedures-General,Procedures-Lithography,acid-hood,asherMatrix-TRL,asher-TRL,coater,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,EV1,EV-LC,Filmetrics-TRL,Greenflo,Heidelberg,hotplate1,hotplate2,hotplate300,MA-6,MLA-150,nanospec,OAI-Flood,photo-wet-Au,photo-wet-l,photo-wet-r,PMMAspinner,postbake,prebakeovn,Resonetics,SolventHood-TRL,varTemp,
|
| Polyimide
| Cleanroom compatible polyimide (photosensitive or not)
| acid-hood-EML,asher-EML,coater-EML,filmetrics,MA-4,photo-hood-EML,SolventHood-EML,i-stepper,UV1280,Procedures-Cleaning,Procedures-Lithography,coater,ellipsometer-TRL,EV1,EV-LC,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,MA-6,nanospec,OAI-Flood,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,Resonetics,SolventHood-TRL,varTemp,
|
| Pyrex
| Pyrex glass, and therefore sodium contaminated
| acid-hood-EML,diesaw,diesaw-3240,Procedures-Etching,Procedures-Metrology,acid-hood,develop-Brewer,EV501,EV620,Greenflo,
|
| Quartz
| Quartz, and therefore sodium free
| acid-hood-EML,diesaw,diesaw-3240,Procedures-Etching,Procedures-Metrology,acid-hood,develop-Brewer,Greenflo,
|
| Silicon
| Silicon or polysilicon, as part of the wafer or deposited
| acid-hood-EML,OxidationTube,plasmatherm,6A-nPoly,6B-Poly,AME5000,DCVD,diesaw,diesaw-3240,epi-Centura,GnP,LAM490B,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,SM-300,TMAH-KOHhood,Procedures-Cleaning,Procedures-Etching,Procedures-Metrology,acid-hood,B2-Ox-alloy-Poly,B4-Poly,develop-Brewer,EV501,EV620,Greenflo,HMDS-TRL,plasmaquest,Resonetics,RTA-HiT,sts1,sts2,sts-CVD,sts-Pegasus,XeF2,
|
| SiNx
| Silicon nitride, stoichiometric or deposited
| acid-hood-EML,anneal-furnace,Box-Furnace,filmetrics,plasmatherm,RTA-EML,5B-Anneal,6D-Nitride,AME5000,concept1,DCVD,GnP,LAM490B,LAM590-ICL,nitrEtch-HotPhos,Oxford-100_PECVD,Oxford-100_Etch,UV1280,VTR,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A3-Sinter,acid-hood,ellipsometer-TRL,Filmetrics-TRL,Greenflo,HMDS-TRL,LAM590-TRL,nanospec,plasmaquest,sts1,sts2,sts-CVD,sts-Pegasus,
|
| SiO2
| Silicon dioxide, thermally grown or deposited
| acid-hood-EML,anneal-furnace,Box-Furnace,filmetrics,OxidationTube,plasmatherm,RTA-EML,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6C-LTO,AME5000,concept1,DCVD,GnP,LAM490B,LAM590-ICL,oxEtch-BOE,Oxford-100_PECVD,Oxford-100_Etch,rca-ICL,UV1280,Procedures-Deposition,Procedures-Etching,Procedures-Metrology,A1-GateOx,A2-WetOxBond,A3-Sinter,acid-hood,B2-Ox-alloy-Poly,B3-DryOx,ellipsometer-TRL,Filmetrics-TRL,Greenflo,HMDS-TRL,LAM590-TRL,nanospec,plasmaquest,sts-CVD,
|
| Solvents
| Cleanroom solvents
| photo-hood-EML,SolventHood-EML,Procedures-Cleaning,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,
|
| SU8
| Cleanroom SU8 polymers (photosensitive or not)
| acid-hood-EML,coater-EML,filmetrics,MA-4,photo-hood-EML,Procedures-Cleaning,Procedures-Lithography,ellipsometer-TRL,EV1,Filmetrics-TRL,hotplate1,hotplate2,hotplate300,nanospec,OAI-Flood,Resonetics,SU8spinner,
|