Equipment
| Lab and Coral Name | EML / anneal-furnace |
| Model | 0 |
| Specialist | Kurt Broderick (Timothy Turner, Gary Riggott) |
| Physical Location | TBD |
Classification
| Process Category | Diffusion |
| Subcategory | Bake |
| Material Keywords | SiO2, SiNx, Dielectrics, CMOS Metals, Non-CMOS Metals, Non-Standard Materials |
| Sample Size | 4" Wafers, Pieces |
| Alternative | EML / Box-Furnace |
| Keywords | multi wafer, manual load, multiple pieces, top side of sample, vacuum, temperature, manual operation |
Description
The anneal-furnace is a tube furnace for annealing, sintering, and other heat treatments. O2, N2, and N2/H2 (with prior arrangement with staff) environments can be established. Useful for reducing processes in H2, up to 800C. This furnace is not programable.
| Best for | Annealing and sintering of materials. |
| Limitations | Long cooldown time (### how long?), maximum temperature is 600C. |
| Characteristics/FOM | |
| Caution with | Most users manually enter the temperature set point and the furnace will heat up to the temperature as fast as possible. It is possible to program temperature profiles. Make sure it is in the proper mode before leaving the machine unattended. |
| Machine Charges | 8/hour |
Documents
Process Matrix Details
PTC Matrix does not apply for EML
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL