Machines by Process Category: Diffusion
Process | Lab | Tool | Subcategory | Description | |
---|---|---|---|---|---|
EML | anneal-furnace | Bake | Anneal Furnace | ||
EML | Box-Furnace | Bake | Anneal Furnace | ||
EML | OxidationTube | Oxidation | Oxidation Furnace | ||
EML | RTA-EML | Bake | Rapid Thermal Annealing | ||
EML | vac-oven | Bake | Temperature controlled vacuum oven | ||
ICL | 5A-GateOx | Oxidation | Diffusion tube for gate oxide growth | ||
ICL | 5B-Anneal | Bake | Annealing tube | ||
ICL | 5C-FieldOx | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 5D-ThickOx | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 6A-nPoly | CVD | Polysilicon deposition tube for n-type poly Si | ||
ICL | 6B-Poly | CVD | Polysilicon deposition tube for p-type poly Si | ||
ICL | 6C-LTO | CVD | Low temperature CVD oxide deposition | ||
ICL | 6D-Nitride | CVD | Deposition of stoichiometric silicon nitride | ||
ICL | rca-ICL | Clean | Wafer cleaning before diffusion tubes | ||
ICL | RTA2 | Bake | Rapid Thermal Annealing | ||
ICL | RTA-pieces | Bake | Rapid Thermal Annealing | ||
ICL | RTP | Bake | Rapid Thermal Annealing | ||
ICL | RTP-Si | Bake | Rapid Thermal Annealing | ||
ICL | VTR | CVD | Low stress silicon nitride deposition | ||
TRL | A1-GateOx | Oxidation | Thermal Oxidation for Green Silicon Wafers | ||
TRL | A2-WetOxBond | Oxidation | Thermal Oxidation and other thermal process for GREEN Si wafers | ||
TRL | A3-Sinter | Bake | Sintering for GREEN Si wafers | ||
TRL | A4-III-Vanneal | Bake | Annealing for GREEN III-V samples | ||
TRL | B1-Au | Oxidation | Gold compatible anneal tube | ||
TRL | B2-Ox-alloy-Poly | Oxidation | Thermal Oxidation and LPCVD Polysilicon for RED wafers | ||
TRL | B3-DryOx | Oxidation | Thermal Oxidation | ||
TRL | B4-Poly | CVD | LPCVD polysilicon for Green wafers | ||
TRL | rca-TRL | Clean | Wafer cleaning before diffusion tubes | ||
TRL | RTA-HiT | Bake | Rapid Thermal Annealing |