My Process:

View by Attribute: Process Category

The process categories are likely the most useful way to find tool capabilities. Start here, but keep in mind the difference between EML and ICL/TRL, and that samples once processed in EML cannot re-enter ICL or TRL. Also, please keep in mind the PTC Matrix, which establishes a set of rules to prevent cross-contamination of samples and tools.


AttributeDescriptionTool List
Deposition Deposition of material ALD-EML,BalzerSputterer,eBeam-AJA,plasmatherm,SputtererAJA,ALD,ALD-Oxford,concept1,DCVD,eBeam-EVO,endura,epi-Centura,Oxford-100_PECVD,Oxford-100_Etch,AJA-TRL,Balzer-Elionix,CCNT,eBeamAu,eBeamFP,parylene,PZTcoater,PZTfurnace,sts-CVD,
Diffusion Diffusion, oxidation and annealing anneal-furnace,Box-Furnace,OxidationTube,RTA-EML,vac-oven,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,VTR,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,rca-TRL,RTA-HiT,
Etch Dry etching of materials plasmatherm,AME5000,LAM490B,LAM590-ICL,Oxford-100_PECVD,Oxford-100_Etch,rainbow,LAM590-TRL,plasmaquest,SAMCO,sts1,sts2,sts-Pegasus,UVozone-Au,XeF2,
Metrology Test and measurement dektak-EML,filmetrics,parametric-tester,semNeo,4-pt-probe,AFM,cv,P10,semZeiss,SM-300,UV1280,wykoICL,dek-NoAu,dektak-XT,ellipsometer-TRL,Filmetrics-TRL,FLX,Hall-probe,IV-probe,nanospec,WYKO,
Packaging Device packaging diesaw,diesaw-3240,goldwire,AutoBonder,BallBonder,WedgeBonder,X-rayInspection,DieBonder,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
Photo Photolithography Elionix,asher-EML,coater-EML,hotpress,MA-4,asher-ICL,pTrack,i-stepper,asherMatrix-TRL,asher-TRL,coater,develop-Brewer,EV1,EV501,EV620,EV-LC,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,MA-6,MLA-150,OAI-Flood,PMMAspinner,postbake,prebakeovn,Resonetics,SU8oven,SU8spinner,TBM-8,varTemp,
Procedures General procedures Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-General,Procedures-Lithography,Procedures-Metrology,OutsideLab,CNS,NSL,SNL,
Wet Wet chemical processes, acids and solvents acid-hood-EML,photo-hood-EML,SolventHood-EML,2Dtransfer-platingHood,GnP,nitrEtch-HotPhos,oxEtch-BOE,premetal-Piranha,TMAH-KOHhood,acid-hood,Greenflo,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,