Equipment
Lab and Coral NameEML / MA-4
ModelKarl Suss MA-4
SpecialistKurt Broderick    (Timothy Turner, Gary Riggott)
Physical LocationTBD
Classification
Process CategoryPhoto
SubcategoryExpose
Material KeywordsPolyimide, SU8, Other Polymers, Photoresist
Sample Size4" Wafers, Pieces
AlternativeTRL / MA-6
Keywordssingle wafer, manual load, top side of sample, manual operation, alignment
Description
The MA-4 provides contact alignment photolithography exposure using a 365nm light source. A split field revolving microscope with 3.5x, 10x, and 25x objectives, and 10x binocular eyepieces objectives as well as X, Y, and theta micrometers are available to assist with manual wafer to mask alignment. Soft and hard contact modes are available as well as multi-exposure to prevent photoresist burning. Accepts glass masks and mylar transparencies.

Best forExperimental materials & short-loop testing, Initial photolithography training
Limitations
Characteristics/FOM9-10 mW/cm2 365nm source, 1um SPR700 exposure: 12 seconds
Caution with
Machine Charges6/wafer
Documents

SOP
MA-4SOP for the MA-4 mask aligner
Resist RecipesBaseline resist recipes for TRL

External Links
GuideMicroChem Application Notes
Process Matrix Details


PTC Matrix does not apply for EML
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL