The user needs to align the sample to the tool (with varying need for accuracy), usually for lithography but also for test & measurement

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Process	Lab	Tool	Process Category	Subcategory	Description	Color Code
+	EBL	Elionix	Photo	Expose	Electron beam lithography system	Red &Green
+	EML	dektak-EML	Metrology	Profile	Surface Profilerometer	EML
+	EML	filmetrics	Metrology	Thickness	Thin Film Optical Measurement	EML
+	EML	hotpress	Photo	Bond	Pressing for thermoplastic films	EML
+	EML	MA-4	Photo	Expose	Contact Lithography Mask Aligner	EML
+	EML	parametric-tester	Metrology	Electrical	Probe station for electrical measurements	EML
+	EML	semNeo	Metrology	SEM	Very Basic Electron Microscope	EML
+	ICL	4-pt-probe	Metrology	Electrical	Sheet resistance measurement of semiconductors	Red
+	ICL	AFM	Metrology	Profile	Atomic Force Microscope for Surface Analysis	Red &Green
+	ICL	cv	Metrology	Electrical	Electrical characterization of dielectrics	Green
+	ICL	diesaw	Packaging	Physical	Wafer dicing saw	Red
+	ICL	diesaw-3240	Packaging	Physical	Wafer dicing saw	Red
+	ICL	goldwire	Packaging	Physical	Gold ball bonder for device packaging	Red
+	ICL	i-stepper	Photo	Expose	i-line stepper	Red &Green
+	ICL	P10	Metrology	Profile	Stylus profilerometer	Green
+	ICL	semZeiss	Metrology	SEM	Scanning Electron Microscope	Red &Green
+	ICL	UV1280	Metrology	Thickness	Thin film characterization	Green
+	TRL	dek-NoAu	Metrology	Profile	Stylus Profilerometer	Green
+	TRL	dektak-XT	Metrology	Profile	Stylus Profilerometer	Red
+	TRL	ellipsometer-TRL	Metrology	Thickness	Thin film thickness measurement	Red &Green
+	TRL	EV1	Photo	Expose	Contact mask aligner	Red &Green
+	TRL	EV501	Photo	Bond	Bonder system to apply heat, vacuum and pressure	Red &Green
+	TRL	EV620	Photo	Bond	Aligner for bonding	Red &Green
+	TRL	EV-LC	Photo	Expose	Contact mask aligner	Red &Green
+	TRL	Filmetrics-TRL	Metrology	Thickness	Thin film thickness measurement	Red &Green
+	TRL	FLX	Metrology	Profile	Thin film stress measurement	Red &Green
+	TRL	Hall-probe	Metrology	Electrical	Carrier measurement	Red
+	TRL	Heidelberg	Photo	Expose	Laser direct-write exposure for wafers and masks	Red &Green
+	TRL	IV-probe	Metrology	Electrical	Probe station with curve tracer for IV measurement	Red
+	TRL	MA-6	Photo	Expose	Contact mask aligner	Red &Green
+	TRL	MLA-150	Photo	Expose	Direct-write lithography for wafers and larger pieces	Red &Green
+	TRL	nanospec	Metrology	Thickness	Thin film thickness measurement	Red &Green
+	TRL	Resonetics	Photo	Expose	Laser ablation system	Red
+	TRL	TBM-8	Photo	Bond	Front-to-back alignement measurement	Red &Green
+	LEAP	AutoBonder	Packaging	Physical	Automated wirebonder	Red
+	LEAP	DieBonder	Packaging	Physical	Automated pick and place	Red
+	LEAP	QuickVisionMicroscope	Packaging	Physical	Automated imaging microscope	Red