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Photo Deposition Etch Diffusion Wet Metrology Packaging Procedures
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Machines by Subcategory: Physical

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ProcessLabToolProcess CategorySubcategoryDescription
Color Code
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ICL diesaw PackagingPhysical Wafer dicing saw
Red
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ICL diesaw-3240 PackagingPhysical Wafer dicing saw
Red
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ICL goldwire PackagingPhysical Gold ball bonder for device packaging
Red
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LEAP AutoBonder PackagingPhysical Automated wirebonder
Red
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LEAP BallBonder PackagingPhysical Manual ball bonder
Red
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LEAP WedgeBonder PackagingPhysical Manual wedge bonder
Red
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LEAP X-rayInspection PackagingPhysical X-Ray imaging
Red
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LEAP DieBonder PackagingPhysical Automated pick and place
Red
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LEAP QuickVisionMicroscope PackagingPhysical Automated imaging microscope
Red