My Process:

View by Attribute: Process Subcategory

The subcategories relate to the physical mode of operation or purpose for a tool. For example, if you are interested in tools that can bake a sample, you will find both furnaces and hotplates. But, it remains your responsibility to evaluate which of these tools is suitable, and in which tool your sample is permitted (e.g. you cannot bake your photoresist in the furnace)


AttributeDescriptionTool List
Acids needs work 2Dtransfer-platingHood,nitrEtch-HotPhos,oxEtch-BOE,premetal-Piranha,TMAH-KOHhood,acid-hood,Greenflo,
Bake needs work anneal-furnace,Box-Furnace,RTA-EML,vac-oven,5B-Anneal,RTA2,RTA-pieces,RTP,RTP-Si,A3-Sinter,A4-III-Vanneal,HMDS-TRL,hotplate1,hotplate2,hotplate300,postbake,prebakeovn,PZTfurnace,RTA-HiT,SU8oven,varTemp,ReflowOven,
Bond needs work hotpress,EV501,EV620,TBM-8,
Clean needs work asher-EML,asher-ICL,rca-ICL,Procedures-Cleaning,asherMatrix-TRL,asher-TRL,rca-TRL,UVozone-Au,PlasmaCleaner,
Coat needs work coater-EML,pTrack,coater,develop-Brewer,PMMAspinner,SU8spinner,
CVD needs work ALD-EML,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,ALD,ALD-Oxford,epi-Centura,VTR,B4-Poly,parylene,
Deposit needs work Procedures-Deposition,
DRIE needs work sts1,sts2,sts-Pegasus,
Electrical 0 parametric-tester,4-pt-probe,cv,Hall-probe,IV-probe,
Etch needs work Procedures-Etching,
Evaporate needs work eBeam-AJA,eBeam-EVO,eBeamAu,eBeamFP,
Expose needs work Elionix,MA-4,i-stepper,EV1,EV-LC,Heidelberg,MA-6,MLA-150,OAI-Flood,Resonetics,
General needs work Procedures-General,OutsideLab,CNS,NSL,SNL,
Metrology needs work Procedures-Metrology,
Other needs work GnP,
Oxidation needs work OxidationTube,5A-GateOx,5C-FieldOx,5D-ThickOx,A1-GateOx,A2-WetOxBond,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,
PECVD needs work plasmatherm,ALD-Oxford,concept1,DCVD,Oxford-100_PECVD,CCNT,sts-CVD,
Photo needs work Procedures-Lithography,
Physical 0 diesaw,diesaw-3240,goldwire,AutoBonder,BallBonder,WedgeBonder,X-rayInspection,DieBonder,QuickVisionMicroscope,
Profile needs work dektak-EML,AFM,P10,wykoICL,dek-NoAu,dektak-XT,FLX,WYKO,
RIE needs work plasmatherm,AME5000,LAM490B,LAM590-ICL,Oxford-100_Etch,rainbow,LAM590-TRL,plasmaquest,SAMCO,XeF2,
SEM 0 semNeo,semZeiss,
Solvents needs work acid-hood-EML,photo-hood-EML,SolventHood-EML,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,
Spin-Coat needs work PZTcoater,
Sputter needs work BalzerSputterer,SputtererAJA,endura,AJA-TRL,Balzer-Elionix,
TBD needs work
Thickness needs work filmetrics,SM-300,UV1280,ellipsometer-TRL,Filmetrics-TRL,nanospec,