Equipment
| Lab and Coral Name | EML / Box-Furnace |
| Model | 0 |
| Specialist | Kurt Broderick (Timothy Turner, Gary Riggott) |
| Physical Location | TBD |
Classification
| Process Category | Diffusion |
| Subcategory | Bake |
| Material Keywords | SiO2, SiNx, Dielectrics, CMOS Metals, Non-CMOS Metals, Non-Standard Materials |
| Sample Size | 6" Wafers, 4" Wafers, Pieces |
| Alternative | EML / OxidationTube |
| Keywords | multi wafer, manual load, multiple pieces, top side of sample, vacuum, temperature, manual operation |
Description
The box furnace allows for annealing of any sample with a diameter 6" or less. Samples are manually loaded at room temperature. Annealing procedures with up to three temperature set points, set point durations, and ramp rates between set points can be programmed and run automatically.
| Best for | Samples that do not require an oxygen free environment during annealing |
| Limitations | Although constantly purged with nitrogen, the ambient is not oxygen free. Temperature ramp rate is slow, ~2 C/min. |
| Characteristics/FOM | Maximum temperature of 1100C. |
| Caution with | |
| Machine Charges | 8/hour |
Documents
Process Matrix Details
PTC Matrix does not apply for EML
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL