Machines by General Keyword: manual operation
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
EBL | Elionix | Photo | Expose | Electron beam lithography system | ||
EML | acid-hood-EML | Wet | Solvents | General Purpose Acid Fume-Hood | ||
EML | ALD-EML | Deposition | CVD | Atomic Layer Deposition | ||
EML | anneal-furnace | Diffusion | Bake | Anneal Furnace | ||
EML | asher-EML | Photo | Clean | Oxygen Plasma | ||
EML | BalzerSputterer | Deposition | Sputter | Thin sputter coating of samples | ||
EML | Box-Furnace | Diffusion | Bake | Anneal Furnace | ||
EML | coater-EML | Photo | Coat | Photoresist Coater | ||
EML | dektak-EML | Metrology | Profile | Surface Profilerometer | ||
EML | eBeam-AJA | Deposition | Evaporate | Metal and dielectric evaporator | ||
EML | filmetrics | Metrology | Thickness | Thin Film Optical Measurement | ||
EML | hotpress | Photo | Bond | Pressing for thermoplastic films | ||
EML | MA-4 | Photo | Expose | Contact Lithography Mask Aligner | ||
EML | OxidationTube | Diffusion | Oxidation | Oxidation Furnace | ||
EML | parametric-tester | Metrology | Electrical | Probe station for electrical measurements | ||
EML | photo-hood-EML | Wet | Solvents | Solvent Fume hood for lithography | ||
EML | RTA-EML | Diffusion | Bake | Rapid Thermal Annealing | ||
EML | semNeo | Metrology | SEM | Very Basic Electron Microscope | ||
EML | SolventHood-EML | Wet | Solvents | Solvent Fume hood for lithography | ||
EML | SputtererAJA | Deposition | Sputter | Sputter deposition tool | ||
EML | vac-oven | Diffusion | Bake | Temperature controlled vacuum oven | ||
TRL | 2Dtransfer-platingHood | Wet | Acids | Electroplating wet bench and fume hood | ||
ICL | 4-pt-probe | Metrology | Electrical | Sheet resistance measurement of semiconductors | ||
ICL | 5A-GateOx | Diffusion | Oxidation | Diffusion tube for gate oxide growth | ||
ICL | 5B-Anneal | Diffusion | Bake | Annealing tube | ||
ICL | 5C-FieldOx | Diffusion | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 5D-ThickOx | Diffusion | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 6A-nPoly | Diffusion | CVD | Polysilicon deposition tube for n-type poly Si | ||
ICL | 6B-Poly | Diffusion | CVD | Polysilicon deposition tube for p-type poly Si | ||
ICL | 6C-LTO | Diffusion | CVD | Low temperature CVD oxide deposition | ||
ICL | 6D-Nitride | Diffusion | CVD | Deposition of stoichiometric silicon nitride | ||
ICL | AFM | Metrology | Profile | Atomic Force Microscope for Surface Analysis | ||
ICL | ALD | Deposition | CVD | Atomic Layer Deposition | ||
ICL | cv | Metrology | Electrical | Electrical characterization of dielectrics | ||
ICL | diesaw | Packaging | Physical | Wafer dicing saw | ||
ICL | diesaw-3240 | Packaging | Physical | Wafer dicing saw | ||
ICL | eBeam-EVO | Deposition | Evaporate | Metal evaporator of CMOS compatible metals | ||
ICL | GnP | Wet | Other | Chemical Mechanical Polishing to planarize surfaces | ||
ICL | goldwire | Packaging | Physical | Gold ball bonder for device packaging | ||
ICL | nitrEtch-HotPhos | Wet | Acids | Hot phosphoric nitride etch bath | ||
ICL | oxEtch-BOE | Wet | Acids | Silicon dioxide etch bath | ||
ICL | P10 | Metrology | Profile | Stylus profilerometer | ||
ICL | premetal-Piranha | Wet | Acids | Piranha resist removal and cleaning station | ||
ICL | rca-ICL | Diffusion | Clean | Wafer cleaning before diffusion tubes | ||
ICL | semZeiss | Metrology | SEM | Scanning Electron Microscope | ||
ICL | SM-300 | Metrology | Thickness | Thickness measurement for CMP processing | ||
ICL | TMAH-KOHhood | Wet | Acids | Silicon bulk wet etching | ||
ICL | wykoICL | Metrology | Profile | Optical profiling system | ||
TRL | A1-GateOx | Diffusion | Oxidation | Thermal Oxidation for Green Silicon Wafers | ||
TRL | A2-WetOxBond | Diffusion | Oxidation | Thermal Oxidation and other thermal process for GREEN Si wafers | ||
TRL | A3-Sinter | Diffusion | Bake | Sintering for GREEN Si wafers | ||
TRL | A4-III-Vanneal | Diffusion | Bake | Annealing for GREEN III-V samples | ||
TRL | acid-hood | Wet | Acids | Acid processing station | ||
TRL | AJA-TRL | Deposition | Sputter | Sputter deposition tool | ||
TRL | asher-TRL | Photo | Clean | Barrel asher for resist removal | ||
TRL | B1-Au | Diffusion | Oxidation | Gold compatible anneal tube | ||
TRL | B2-Ox-alloy-Poly | Diffusion | Oxidation | Thermal Oxidation and LPCVD Polysilicon for RED wafers | ||
TRL | B3-DryOx | Diffusion | Oxidation | Thermal Oxidation | ||
TRL | B4-Poly | Diffusion | CVD | LPCVD polysilicon for Green wafers | ||
TRL | Balzer-Elionix | Deposition | Sputter | SEM or EBL sample preparation | ||
TRL | CCNT | Deposition | PECVD | Carbon nanotube growth | ||
TRL | coater | Photo | Coat | Manual spin-coater for photoresists | ||
TRL | dek-NoAu | Metrology | Profile | Stylus Profilerometer | ||
TRL | dektak-XT | Metrology | Profile | Stylus Profilerometer | ||
TRL | eBeamAu | Deposition | Evaporate | Metal evaporator | ||
TRL | ellipsometer-TRL | Metrology | Thickness | Thin film thickness measurement | ||
TRL | EV1 | Photo | Expose | Contact mask aligner | ||
TRL | EV501 | Photo | Bond | Bonder system to apply heat, vacuum and pressure | ||
TRL | EV620 | Photo | Bond | Aligner for bonding | ||
TRL | EV-LC | Photo | Expose | Contact mask aligner | ||
TRL | Filmetrics-TRL | Metrology | Thickness | Thin film thickness measurement | ||
TRL | FLX | Metrology | Profile | Thin film stress measurement | ||
TRL | Greenflo | Wet | Acids | Acid processing station | ||
TRL | Hall-probe | Metrology | Electrical | Carrier measurement | ||
TRL | Heidelberg | Photo | Expose | Laser direct-write exposure for wafers and masks | ||
TRL | hotplate1 | Photo | Bake | Hotplate for lithography | ||
TRL | hotplate2 | Photo | Bake | Hotplate for lithography | ||
TRL | hotplate300 | Photo | Bake | Hotplate for lithography | ||
TRL | IV-probe | Metrology | Electrical | Probe station with curve tracer for IV measurement | ||
TRL | MA-6 | Photo | Expose | Contact mask aligner | ||
TRL | MLA-150 | Photo | Expose | Direct-write lithography for wafers and larger pieces | ||
TRL | nanospec | Metrology | Thickness | Thin film thickness measurement | ||
TRL | OAI-Flood | Photo | Expose | Flood exposure for image reversal resists | ||
TRL | parylene | Deposition | CVD | Parylene depopsition | ||
TRL | photo-wet-Au | Wet | Solvents | Solvent fume hood with sonicator | ||
TRL | photo-wet-l | Wet | Solvents | Wetbench for photoresist development | ||
TRL | photo-wet-r | Wet | Solvents | Wetbench for photoresist development | ||
TRL | plasmaquest | Etch | RIE | Fluorine and Chlorine general purpose plasma deposition and etch tool | ||
TRL | PMMAspinner | Photo | Coat | Manual coater for PMMA and other photoresists | ||
TRL | PZTcoater | Deposition | Spin-Coat | Coater to apply PZT films | ||
TRL | PZTfurnace | Deposition | Bake | Bake oven for PZT coated wafers | ||
TRL | rca-TRL | Diffusion | Clean | Wafer cleaning before diffusion tubes | ||
TRL | Resonetics | Photo | Expose | Laser ablation system | ||
TRL | SolventHood-TRL | Wet | Solvents | Solvent fume hood | ||
TRL | sts1 | Etch | DRIE | Deep reactive ion etcher for silicon | ||
TRL | SU8spinner | Photo | Coat | Manual spin-coater for SU8 resists | ||
TRL | TBM-8 | Photo | Bond | Front-to-back alignement measurement | ||
TRL | UVozone-Au | Etch | Clean | Cleans residual organics | ||
TRL | varTemp | Photo | Bake | Bake oven for variable temperature | ||
TRL | WYKO | Metrology | Profile | Optical profiling system | ||
TRL | XeF2 | Etch | RIE | XeF2 isotropic etching of silicon | ||
LEAP | BallBonder | Packaging | Physical | Manual ball bonder | ||
LEAP | WedgeBonder | Packaging | Physical | Manual wedge bonder | ||
LEAP | X-rayInspection | Packaging | Physical | X-Ray imaging | ||
LEAP | PlasmaCleaner | Packaging | Clean | Plasma parts cleaning | ||
LEAP | ReflowOven | Packaging | Bake | Reflow oven |