Machines by Lab: TRL
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| TRL | 2Dtransfer-platingHood | Wet | Acids | Electroplating wet bench and fume hood | ||
| TRL | A1-GateOx | Diffusion | Oxidation | Thermal Oxidation for Green Silicon Wafers | ||
| TRL | A2-WetOxBond | Diffusion | Oxidation | Thermal Oxidation and other thermal process for GREEN Si wafers | ||
| TRL | A3-Sinter | Diffusion | Bake | Sintering for GREEN Si wafers | ||
| TRL | A4-III-Vanneal | Diffusion | Bake | Annealing for GREEN III-V samples | ||
| TRL | acid-hood | Wet | Acids | Acid processing station | ||
| TRL | AJA-TRL | Deposition | Sputter | Sputter deposition tool | ||
| TRL | asherMatrix-TRL | Photo | Clean | Single wafer oxygen plasma for photoresist removal | ||
| TRL | asher-TRL | Photo | Clean | Barrel asher for resist removal | ||
| TRL | B1-Au | Diffusion | Oxidation | Gold compatible anneal tube | ||
| TRL | B2-Ox-alloy-Poly | Diffusion | Oxidation | Thermal Oxidation and LPCVD Polysilicon for RED wafers | ||
| TRL | B3-DryOx | Diffusion | Oxidation | Thermal Oxidation | ||
| TRL | B4-Poly | Diffusion | CVD | LPCVD polysilicon for Green wafers | ||
| TRL | Balzer-Elionix | Deposition | Sputter | SEM or EBL sample preparation | ||
| TRL | CCNT | Deposition | PECVD | Carbon nanotube growth | ||
| TRL | coater | Photo | Coat | Manual spin-coater for photoresists | ||
| TRL | dek-NoAu | Metrology | Profile | Stylus Profilerometer | ||
| TRL | dektak-XT | Metrology | Profile | Stylus Profilerometer | ||
| TRL | develop-Brewer | Photo | Coat | Resist develop and postbake | ||
| TRL | eBeamAu | Deposition | Evaporate | Metal evaporator | ||
| TRL | eBeamFP | Deposition | Evaporate | Fast pumping metal evaporator | ||
| TRL | ellipsometer-TRL | Metrology | Thickness | Thin film thickness measurement | ||
| TRL | EV1 | Photo | Expose | Contact mask aligner | ||
| TRL | EV501 | Photo | Bond | Bonder system to apply heat, vacuum and pressure | ||
| TRL | EV620 | Photo | Bond | Aligner for bonding | ||
| TRL | EV-LC | Photo | Expose | Contact mask aligner | ||
| TRL | Filmetrics-TRL | Metrology | Thickness | Thin film thickness measurement | ||
| TRL | FLX | Metrology | Profile | Thin film stress measurement | ||
| TRL | Greenflo | Wet | Acids | Acid processing station | ||
| TRL | Hall-probe | Metrology | Electrical | Carrier measurement | ||
| TRL | Heidelberg | Photo | Expose | Laser direct-write exposure for wafers and masks | ||
| TRL | HMDS-TRL | Photo | Bake | HMDS oven | ||
| TRL | hotplate1 | Photo | Bake | Hotplate for lithography | ||
| TRL | hotplate2 | Photo | Bake | Hotplate for lithography | ||
| TRL | hotplate300 | Photo | Bake | Hotplate for lithography | ||
| TRL | IV-probe | Metrology | Electrical | Probe station with curve tracer for IV measurement | ||
| TRL | LAM590-TRL | Etch | RIE | Fluorine based plasma etching of oxide and nitrides | ||
| TRL | MA-6 | Photo | Expose | Contact mask aligner | ||
| TRL | MLA-150 | Photo | Expose | Direct-write lithography for wafers and larger pieces | ||
| TRL | nanospec | Metrology | Thickness | Thin film thickness measurement | ||
| TRL | OAI-Flood | Photo | Expose | Flood exposure for image reversal resists | ||
| TRL | parylene | Deposition | CVD | Parylene depopsition | ||
| TRL | photo-wet-Au | Wet | Solvents | Solvent fume hood with sonicator | ||
| TRL | photo-wet-l | Wet | Solvents | Wetbench for photoresist development | ||
| TRL | photo-wet-r | Wet | Solvents | Wetbench for photoresist development | ||
| TRL | plasmaquest | Etch | RIE | Fluorine and Chlorine general purpose plasma deposition and etch tool | ||
| TRL | PMMAspinner | Photo | Coat | Manual coater for PMMA and other photoresists | ||
| TRL | postbake | Photo | Bake | Bake oven 120C | ||
| TRL | prebakeovn | Photo | Bake | Bake oven 90C | ||
| TRL | PZTcoater | Deposition | Spin-Coat | Coater to apply PZT films | ||
| TRL | PZTfurnace | Deposition | Bake | Bake oven for PZT coated wafers | ||
| TRL | rca-TRL | Diffusion | Clean | Wafer cleaning before diffusion tubes | ||
| TRL | Resonetics | Photo | Expose | Laser ablation system | ||
| TRL | RTA-HiT | Diffusion | Bake | Rapid Thermal Annealing | ||
| TRL | SAMCO | Etch | RIE | Chlorine based plasma etcher for III-V materials | ||
| TRL | SolventHood-TRL | Wet | Solvents | Solvent fume hood | ||
| TRL | sts1 | Etch | DRIE | Deep reactive ion etcher for silicon | ||
| TRL | sts2 | Etch | DRIE | Deep reactive ion etcher for silicon | ||
| TRL | sts-CVD | Deposition | PECVD | PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si | ||
| TRL | sts-Pegasus | Etch | DRIE | Deep reactive ion etcher for silicon | ||
| TRL | SU8oven | Photo | Bake | Oven to dry foil from SU8 coater | ||
| TRL | SU8spinner | Photo | Coat | Manual spin-coater for SU8 resists | ||
| TRL | TBM-8 | Photo | Bond | Front-to-back alignement measurement | ||
| TRL | UVozone-Au | Etch | Clean | Cleans residual organics | ||
| TRL | varTemp | Photo | Bake | Bake oven for variable temperature | ||
| TRL | WYKO | Metrology | Profile | Optical profiling system | ||
| TRL | XeF2 | Etch | RIE | XeF2 isotropic etching of silicon |