+ | TRL |
2Dtransfer-platingHood
| Wet | Acids
| Electroplating wet bench and fume hood
| Red
|
+ | TRL |
A1-GateOx
| Diffusion | Oxidation
| Thermal Oxidation for Green Silicon Wafers
| Green
|
+ | TRL |
A2-WetOxBond
| Diffusion | Oxidation
| Thermal Oxidation and other thermal process for GREEN Si wafers
| Green
|
+ | TRL |
A3-Sinter
| Diffusion | Bake
| Sintering for GREEN Si wafers
| Green
|
+ | TRL |
A4-III-Vanneal
| Diffusion | Bake
| Annealing for GREEN III-V samples
| Red
|
+ | TRL |
acid-hood
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
AJA-TRL
| Deposition | Sputter
| Sputter deposition tool
| Red
|
+ | TRL |
asherMatrix-TRL
| Photo | Clean
| Single wafer oxygen plasma for photoresist removal
| Red
|
+ | TRL |
asher-TRL
| Photo | Clean
| Barrel asher for resist removal
| Red &Green
|
+ | TRL |
B1-Au
| Diffusion | Oxidation
| Gold compatible anneal tube
| Red
|
+ | TRL |
B2-Ox-alloy-Poly
| Diffusion | Oxidation
| Thermal Oxidation and LPCVD Polysilicon for RED wafers
| Green
|
+ | TRL |
B3-DryOx
| Diffusion | Oxidation
| Thermal Oxidation
| Green
|
+ | TRL |
B4-Poly
| Diffusion | CVD
| LPCVD polysilicon for Green wafers
| Green
|
+ | TRL |
Balzer-Elionix
| Deposition | Sputter
| SEM or EBL sample preparation
| Red
|
+ | TRL |
CCNT
| Deposition | PECVD
| Carbon nanotube growth
| Red
|
+ | TRL |
coater
| Photo | Coat
| Manual spin-coater for photoresists
| Red &Green
|
+ | TRL |
dek-NoAu
| Metrology | Profile
| Stylus Profilerometer
| Green
|
+ | TRL |
dektak-XT
| Metrology | Profile
| Stylus Profilerometer
| Red
|
+ | TRL |
develop-Brewer
| Photo | Coat
| Resist develop and postbake
| Red &Green
|
+ | TRL |
eBeamAu
| Deposition | Evaporate
| Metal evaporator
| Red
|
+ | TRL |
eBeamFP
| Deposition | Evaporate
| Fast pumping metal evaporator
| Red
|
+ | TRL |
ellipsometer-TRL
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
EV1
| Photo | Expose
| Contact mask aligner
| Red &Green
|
+ | TRL |
EV501
| Photo | Bond
| Bonder system to apply heat, vacuum and pressure
| Red &Green
|
+ | TRL |
EV620
| Photo | Bond
| Aligner for bonding
| Red &Green
|
+ | TRL |
EV-LC
| Photo | Expose
| Contact mask aligner
| Red &Green
|
+ | TRL |
Filmetrics-TRL
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
FLX
| Metrology | Profile
| Thin film stress measurement
| Red &Green
|
+ | TRL |
Greenflo
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
Hall-probe
| Metrology | Electrical
| Carrier measurement
| Red
|
+ | TRL |
Heidelberg
| Photo | Expose
| Laser direct-write exposure for wafers and masks
| Red &Green
|
+ | TRL |
HMDS-TRL
| Photo | Bake
| HMDS oven
| Red &Green
|
+ | TRL |
hotplate1
| Photo | Bake
| Hotplate for lithography
| Red &Green
|
+ | TRL |
hotplate2
| Photo | Bake
| Hotplate for lithography
| Red &Green
|
+ | TRL |
hotplate300
| Photo | Bake
| Hotplate for lithography
| Red &Green
|
+ | TRL |
IV-probe
| Metrology | Electrical
| Probe station with curve tracer for IV measurement
| Red
|
+ | TRL |
LAM590-TRL
| Etch | RIE
| Fluorine based plasma etching of oxide and nitrides
| Red
|
+ | TRL |
MA-6
| Photo | Expose
| Contact mask aligner
| Red &Green
|
+ | TRL |
MLA-150
| Photo | Expose
| Direct-write lithography for wafers and larger pieces
| Red &Green
|
+ | TRL |
nanospec
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
OAI-Flood
| Photo | Expose
| Flood exposure for image reversal resists
| Red &Green
|
+ | TRL |
parylene
| Deposition | CVD
| Parylene depopsition
| Red
|
+ | TRL |
photo-wet-Au
| Wet | Solvents
| Solvent fume hood with sonicator
| Red &Green
|
+ | TRL |
photo-wet-l
| Wet | Solvents
| Wetbench for photoresist development
| Red &Green
|
+ | TRL |
photo-wet-r
| Wet | Solvents
| Wetbench for photoresist development
| Red &Green
|
+ | TRL |
plasmaquest
| Etch | RIE
| Fluorine and Chlorine general purpose plasma deposition and etch tool
| Red
|
+ | TRL |
PMMAspinner
| Photo | Coat
| Manual coater for PMMA and other photoresists
| Red &Green
|
+ | TRL |
postbake
| Photo | Bake
| Bake oven 120C
| Red &Green
|
+ | TRL |
prebakeovn
| Photo | Bake
| Bake oven 90C
| Red &Green
|
+ | TRL |
PZTcoater
| Deposition | Spin-Coat
| Coater to apply PZT films
| Red
|
+ | TRL |
PZTfurnace
| Deposition | Bake
| Bake oven for PZT coated wafers
| Red
|
+ | TRL |
rca-TRL
| Diffusion | Clean
| Wafer cleaning before diffusion tubes
| Green
|
+ | TRL |
Resonetics
| Photo | Expose
| Laser ablation system
| Red
|
+ | TRL |
RTA-HiT
| Diffusion | Bake
| Rapid Thermal Annealing
| Red
|
+ | TRL |
SAMCO
| Etch | RIE
| Chlorine based plasma etcher for III-V materials
| Red
|
+ | TRL |
SolventHood-TRL
| Wet | Solvents
| Solvent fume hood
| Red &Green
|
+ | TRL |
sts1
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
sts2
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Green
|
+ | TRL |
sts-CVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|
+ | TRL |
sts-Pegasus
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
SU8oven
| Photo | Bake
| Oven to dry foil from SU8 coater
| Purple
|
+ | TRL |
SU8spinner
| Photo | Coat
| Manual spin-coater for SU8 resists
| Purple
|
+ | TRL |
TBM-8
| Photo | Bond
| Front-to-back alignement measurement
| Red &Green
|
+ | TRL |
UVozone-Au
| Etch | Clean
| Cleans residual organics
| Red
|
+ | TRL |
varTemp
| Photo | Bake
| Bake oven for variable temperature
| Red
|
+ | TRL |
WYKO
| Metrology | Profile
| Optical profiling system
| Red &Green
|
+ | TRL |
XeF2
| Etch | RIE
| XeF2 isotropic etching of silicon
| Red
|