After a device has been fabricated in the cleanroom, it can be packaged by dicing it out of the wafer, placing it inside a package, making electrical or other connections to it, and sealing it for protection. Most packaging is done in individual research labs, but MTL provides the ability to dice the wafer into small dies as well as allow users to gold wirebond for electrical connections.

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Process	Lab	Tool	Subcategory	Description	Color Code
+	ICL	diesaw	Physical	Wafer dicing saw	Red
+	ICL	diesaw-3240	Physical	Wafer dicing saw	Red
+	ICL	goldwire	Physical	Gold ball bonder for device packaging	Red
+	LEAP	AutoBonder	Physical	Automated wirebonder	Red
+	LEAP	BallBonder	Physical	Manual ball bonder	Red
+	LEAP	WedgeBonder	Physical	Manual wedge bonder	Red
+	LEAP	X-rayInspection	Physical	X-Ray imaging	Red
+	LEAP	DieBonder	Physical	Automated pick and place	Red
+	LEAP	PlasmaCleaner	Clean	Plasma parts cleaning	Red
+	LEAP	ReflowOven	Bake	Reflow oven	Red
+	LEAP	QuickVisionMicroscope	Physical	Automated imaging microscope	Red