Machines by Lab: ICL
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
ICL | 4-pt-probe | Metrology | Electrical | Sheet resistance measurement of semiconductors | ||
ICL | 5A-GateOx | Diffusion | Oxidation | Diffusion tube for gate oxide growth | ||
ICL | 5B-Anneal | Diffusion | Bake | Annealing tube | ||
ICL | 5C-FieldOx | Diffusion | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 5D-ThickOx | Diffusion | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 6A-nPoly | Diffusion | CVD | Polysilicon deposition tube for n-type poly Si | ||
ICL | 6B-Poly | Diffusion | CVD | Polysilicon deposition tube for p-type poly Si | ||
ICL | 6C-LTO | Diffusion | CVD | Low temperature CVD oxide deposition | ||
ICL | 6D-Nitride | Diffusion | CVD | Deposition of stoichiometric silicon nitride | ||
ICL | AFM | Metrology | Profile | Atomic Force Microscope for Surface Analysis | ||
ICL | ALD | Deposition | CVD | Atomic Layer Deposition | ||
ICL | ALD-Oxford | Deposition | CVD, PECVD | Atomic Layer Deposition | ||
ICL | AME5000 | Etch | RIE | RIE etcher for frontend silicon processes | ||
ICL | asher-ICL | Photo | Clean | Single wafer oxygen plasma for photoresist removal | ||
ICL | pTrack | Photo | Coat | Automated coater and developer track | ||
ICL | concept1 | Deposition | PECVD | PECVD deposition of oxides, nitrides, and TEOS | ||
ICL | cv | Metrology | Electrical | Electrical characterization of dielectrics | ||
ICL | DCVD | Deposition | PECVD | PECVD deposition of oxides, nitrides, and a-Si | ||
ICL | diesaw | Packaging | Physical | Wafer dicing saw | ||
ICL | diesaw-3240 | Packaging | Physical | Wafer dicing saw | ||
ICL | eBeam-EVO | Deposition | Evaporate | Metal evaporator of CMOS compatible metals | ||
ICL | endura | Deposition | Sputter | Metal sputter deposition | ||
ICL | epi-Centura | Deposition | CVD | Not open to public | ||
ICL | GnP | Wet | Other | Chemical Mechanical Polishing to planarize surfaces | ||
ICL | goldwire | Packaging | Physical | Gold ball bonder for device packaging | ||
ICL | i-stepper | Photo | Expose | i-line stepper | ||
ICL | LAM490B | Etch | RIE | Chlorine based plasma etching of silicon | ||
ICL | LAM590-ICL | Etch | RIE | Fluorine based plasma etching of silicon oxide and nitrides | ||
ICL | nitrEtch-HotPhos | Wet | Acids | Hot phosphoric nitride etch bath | ||
ICL | oxEtch-BOE | Wet | Acids | Silicon dioxide etch bath | ||
ICL | Oxford-100_PECVD | Deposition, Etch | PECVD | Dual chamber PECVD and plasma etch tool | ||
ICL | Oxford-100_Etch | Deposition, Etch | RIE | Dual chamber PECVD and plasma etch tool | ||
ICL | P10 | Metrology | Profile | Stylus profilerometer | ||
ICL | premetal-Piranha | Wet | Acids | Piranha resist removal and cleaning station | ||
ICL | rainbow | Etch | RIE | Chlorine based plasma etcher for metals | ||
ICL | rca-ICL | Diffusion | Clean | Wafer cleaning before diffusion tubes | ||
ICL | RTA2 | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTA-pieces | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTP | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTP-Si | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | semZeiss | Metrology | SEM | Scanning Electron Microscope | ||
ICL | SM-300 | Metrology | Thickness | Thickness measurement for CMP processing | ||
ICL | TMAH-KOHhood | Wet | Acids | Silicon bulk wet etching | ||
ICL | UV1280 | Metrology | Thickness | Thin film characterization | ||
ICL | VTR | Diffusion | CVD | Low stress silicon nitride deposition | ||
ICL | wykoICL | Metrology | Profile | Optical profiling system |