Equipment
Lab and Coral Name | ICL / wykoICL |
Model | Wyko NT3300 |
Specialist | Bernard Alamariu (Eric Lim) |
Physical Location | 2F 1-South Metrology |
Classification
Process Category | Metrology |
Subcategory | Profile |
Material Keywords | None |
Sample Size | 8" Wafers, 6" Wafers, 4" Wafers, 7" Photo Plates, 5" Photo Plates, Pieces |
Alternative | None |
Keywords | single wafer, manual load, top side of sample, manual operation |
Description
The WYKO is a non-contact optical profiler to measure surface topology and roughness. It can measure up to 500um of vertical steps. There are two modes, VSI and PSI. The VSI mode is for continuous measurement and surface roughness estaimtes. The PSI mode is for measuring step height. However, if multiple layers of thin films exist, they create additional reflections that can confuse the tool and result in bad measurements.
Best for | surface roughness / step height measurement over large areas |
Limitations | scan speed 7.2 um/s |
Characteristics/FOM | Computer controlled; Matlab codes for analysis. |
Caution with | When more than one material is encountered, the measurement of step height may not be correct. |
Machine Charges | 5/hour |
Documents
Process Matrix Details
Permitted
Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL
For more details or help, please consult PTC matrix, email ptc@mtl.mit.edu, or ask the research specialist (Bernard Alamariu)