Machines by Specialist: Bernard Alamariu
Bernard Alamariu
Research Engineer, Diffusion and Device Characterization
39-213 - (617)253-8811 - bernard@mtl.mit.edu
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
ICL | 4-pt-probe | Metrology | Electrical | Sheet resistance measurement of semiconductors | ||
ICL | 5A-GateOx | Diffusion | Oxidation | Diffusion tube for gate oxide growth | ||
ICL | 5B-Anneal | Diffusion | Bake | Annealing tube | ||
ICL | 5C-FieldOx | Diffusion | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 5D-ThickOx | Diffusion | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 6A-nPoly | Diffusion | CVD | Polysilicon deposition tube for n-type poly Si | ||
ICL | 6B-Poly | Diffusion | CVD | Polysilicon deposition tube for p-type poly Si | ||
ICL | 6C-LTO | Diffusion | CVD | Low temperature CVD oxide deposition | ||
ICL | 6D-Nitride | Diffusion | CVD | Deposition of stoichiometric silicon nitride | ||
ICL | cv | Metrology | Electrical | Electrical characterization of dielectrics | ||
ICL | P10 | Metrology | Profile | Stylus profilerometer | ||
ICL | rca-ICL | Diffusion | Clean | Wafer cleaning before diffusion tubes | ||
ICL | RTA2 | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTA-pieces | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTP | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTP-Si | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | SM-300 | Metrology | Thickness | Thickness measurement for CMP processing | ||
ICL | UV1280 | Metrology | Thickness | Thin film characterization | ||
ICL | wykoICL | Metrology | Profile | Optical profiling system | ||
TRL | A1-GateOx | Diffusion | Oxidation | Thermal Oxidation for Green Silicon Wafers | ||
TRL | A2-WetOxBond | Diffusion | Oxidation | Thermal Oxidation and other thermal process for GREEN Si wafers | ||
TRL | A3-Sinter | Diffusion | Bake | Sintering for GREEN Si wafers | ||
TRL | A4-III-Vanneal | Diffusion | Bake | Annealing for GREEN III-V samples | ||
TRL | B1-Au | Diffusion | Oxidation | Gold compatible anneal tube | ||
TRL | B2-Ox-alloy-Poly | Diffusion | Oxidation | Thermal Oxidation and LPCVD Polysilicon for RED wafers | ||
TRL | B3-DryOx | Diffusion | Oxidation | Thermal Oxidation | ||
TRL | B4-Poly | Diffusion | CVD | LPCVD polysilicon for Green wafers | ||
TRL | dek-NoAu | Metrology | Profile | Stylus Profilerometer | ||
TRL | Filmetrics-TRL | Metrology | Thickness | Thin film thickness measurement | ||
TRL | Hall-probe | Metrology | Electrical | Carrier measurement | ||
TRL | IV-probe | Metrology | Electrical | Probe station with curve tracer for IV measurement | ||
TRL | rca-TRL | Diffusion | Clean | Wafer cleaning before diffusion tubes | ||
TRL | RTA-HiT | Diffusion | Bake | Rapid Thermal Annealing | ||
TRL | WYKO | Metrology | Profile | Optical profiling system |