The key lithography tools to expose photoresists in MTL are: contact aligners (EV1, EV-LC, MLA-150 as well as in EML MA-4), an i-line stepper (i-stepper) and electron beam lithography (Elionix). Similar to the contact aligners is the system for wafer bonding (EV501 EV620). The choice between these tools will strongly depend on your process needs, such as feature sizes, alignment accuracy, overall design size, type of resist used, as well as sample size, time and operating costs. The MLA-150 offers a good starting point for most projects, with good feature sizes and alignment accuracy. Mixing different lithography tools is possible, but this is best considered before completing the mask designs, to avoid surprises such as different alignment mark requirements.

Photoresists can be spin-coated in all labs ([coater6], coater, and in EML coater-EML), but some limitations exist for certain resists. 'Specialty' coaters in TRL are the SU8spinner which is required for SU8, the PMMAspinner which is recommended for PMMA, HSQ, and polyimide coating, and the PZTcoater for PZT spin coating. The ICL coater track is ideal for coating and developing standard positive resist, but requires GREEN processes.

Many resists can either be baked in an oven or on a hotplate. This depends on your recipe, the resist used, and the number of wafers/samples. The photo tools (and lithography procedures page) also link to application notes and data sheets that have a lot of excellent in-depth information.

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Process	Lab	Tool	Subcategory	Description	Color Code
+	EBL	Elionix	Expose	Electron beam lithography system	Red &Green
+	EML	asher-EML	Clean	Oxygen Plasma	EML
+	EML	coater-EML	Coat	Photoresist Coater	EML
+	EML	hotpress	Bond	Pressing for thermoplastic films	EML
+	EML	MA-4	Expose	Contact Lithography Mask Aligner	EML
+	ICL	asher-ICL	Clean	Single wafer oxygen plasma for photoresist removal	Green
+	ICL	pTrack	Coat	Automated coater and developer track	Green
+	ICL	i-stepper	Expose	i-line stepper	Red &Green
+	TRL	asherMatrix-TRL	Clean	Single wafer oxygen plasma for photoresist removal	Red
+	TRL	asher-TRL	Clean	Barrel asher for resist removal	Red &Green
+	TRL	coater	Coat	Manual spin-coater for photoresists	Red &Green
+	TRL	develop-Brewer	Coat	Resist develop and postbake	Red &Green
+	TRL	EV1	Expose	Contact mask aligner	Red &Green
+	TRL	EV501	Bond	Bonder system to apply heat, vacuum and pressure	Red &Green
+	TRL	EV620	Bond	Aligner for bonding	Red &Green
+	TRL	EV-LC	Expose	Contact mask aligner	Red &Green
+	TRL	Heidelberg	Expose	Laser direct-write exposure for wafers and masks	Red &Green
+	TRL	HMDS-TRL	Bake	HMDS oven	Red &Green
+	TRL	hotplate1	Bake	Hotplate for lithography	Red &Green
+	TRL	hotplate2	Bake	Hotplate for lithography	Red &Green
+	TRL	hotplate300	Bake	Hotplate for lithography	Red &Green
+	TRL	MA-6	Expose	Contact mask aligner	Red &Green
+	TRL	MLA-150	Expose	Direct-write lithography for wafers and larger pieces	Red &Green
+	TRL	OAI-Flood	Expose	Flood exposure for image reversal resists	Red &Green
+	TRL	PMMAspinner	Coat	Manual coater for PMMA and other photoresists	Red &Green
+	TRL	postbake	Bake	Bake oven 120C	Red &Green
+	TRL	prebakeovn	Bake	Bake oven 90C	Red &Green
+	TRL	Resonetics	Expose	Laser ablation system	Red
+	TRL	SU8oven	Bake	Oven to dry foil from SU8 coater	Purple
+	TRL	SU8spinner	Coat	Manual spin-coater for SU8 resists	Purple
+	TRL	TBM-8	Bond	Front-to-back alignement measurement	Red &Green
+	TRL	varTemp	Bake	Bake oven for variable temperature	Red