Machines by Material Keyword: None
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| EML | dektak-EML | Metrology | Profile | Surface Profilerometer | ||
| EML | semNeo | Metrology | SEM | Very Basic Electron Microscope | ||
| EML | vac-oven | Diffusion | Bake | Temperature controlled vacuum oven | ||
| ICL | AFM | Metrology | Profile | Atomic Force Microscope for Surface Analysis | ||
| ICL | P10 | Metrology | Profile | Stylus profilerometer | ||
| ICL | semZeiss | Metrology | SEM | Scanning Electron Microscope | ||
| ICL | wykoICL | Metrology | Profile | Optical profiling system | ||
| TRL | B1-Au | Diffusion | Oxidation | Gold compatible anneal tube | ||
| TRL | dek-NoAu | Metrology | Profile | Stylus Profilerometer | ||
| TRL | dektak-XT | Metrology | Profile | Stylus Profilerometer | ||
| TRL | FLX | Metrology | Profile | Thin film stress measurement | ||
| TRL | SU8oven | Photo | Bake | Oven to dry foil from SU8 coater | ||
| TRL | TBM-8 | Photo | Bond | Front-to-back alignement measurement | ||
| TRL | WYKO | Metrology | Profile | Optical profiling system | ||
| LEAP | X-rayInspection | Packaging | Physical | X-Ray imaging | ||
| LEAP | DieBonder | Packaging | Physical | Automated pick and place | ||
| LEAP | PlasmaCleaner | Packaging | Clean | Plasma parts cleaning | ||
| LEAP | ReflowOven | Packaging | Bake | Reflow oven | ||
| LEAP | QuickVisionMicroscope | Packaging | Physical | Automated imaging microscope | ||
| Other | OutsideLab | Procedures | General | Tools used in outside facilities | ||
| Other | CNS | Procedures | General | Tools used in Harvard CNS | ||
| Other | NSL | Procedures | General | Tools used in NSL bldg 39 | ||
| Other | SNL | Procedures | General | Tools used in SNL bldg 37 |