. Note that most wafers are actually 150mm, and not true 6". Wafer flats are required for some tools. Almost all tools can accommodate these wafers.
Process | Lab | Tool | Keywords | 0 | Description
| Color Code
|
---|
+ | EBL |
Elionix
| ERRORERROR
| Electron beam lithography system
| Red &Green
|
+ | EML |
acid-hood-EML
| ERRORERROR
| General Purpose Acid Fume-Hood
| EML
|
+ | EML |
ALD-EML
| ERRORERROR
| Atomic Layer Deposition
| EML
|
+ | EML |
Box-Furnace
| ERRORERROR
| Anneal Furnace
| EML
|
+ | EML |
coater-EML
| ERRORERROR
| Photoresist Coater
| EML
|
+ | EML |
dektak-EML
| ERRORERROR
| Surface Profilerometer
| EML
|
+ | EML |
eBeam-AJA
| ERRORERROR
| Metal and dielectric evaporator
| EML
|
+ | EML |
filmetrics
| ERRORERROR
| Thin Film Optical Measurement
| EML
|
+ | EML |
parametric-tester
| ERRORERROR
| Probe station for electrical measurements
| EML
|
+ | EML |
photo-hood-EML
| ERRORERROR
| Solvent Fume hood for lithography
| EML
|
+ | EML |
plasmatherm
| ERRORERROR
| Plasma Etch and Deposition
| EML
|
+ | EML |
SolventHood-EML
| ERRORERROR
| Solvent Fume hood for lithography
| EML
|
+ | EML |
SputtererAJA
| ERRORERROR
| Sputter deposition tool
| EML
|
+ | EML |
vac-oven
| ERRORERROR
| Temperature controlled vacuum oven
| EML
|
+ | TRL |
2Dtransfer-platingHood
| ERRORERROR
| Electroplating wet bench and fume hood
| Red
|
+ | ICL |
4-pt-probe
| ERRORERROR
| Sheet resistance measurement of semiconductors
| Red
|
+ | ICL |
5A-GateOx
| ERRORERROR
| Diffusion tube for gate oxide growth
| Green
|
+ | ICL |
5B-Anneal
| ERRORERROR
| Annealing tube
| Green
|
+ | ICL |
5C-FieldOx
| ERRORERROR
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
5D-ThickOx
| ERRORERROR
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
6A-nPoly
| ERRORERROR
| Polysilicon deposition tube for n-type poly Si
| Green
|
+ | ICL |
6B-Poly
| ERRORERROR
| Polysilicon deposition tube for p-type poly Si
| Green
|
+ | ICL |
6C-LTO
| ERRORERROR
| Low temperature CVD oxide deposition
| Green
|
+ | ICL |
6D-Nitride
| ERRORERROR
| Deposition of stoichiometric silicon nitride
| Green
|
+ | ICL |
AFM
| ERRORERROR
| Atomic Force Microscope for Surface Analysis
| Red &Green
|
+ | ICL |
ALD
| ERRORERROR
| Atomic Layer Deposition
| Red
|
+ | ICL |
ALD-Oxford
| ERRORERROR
| Atomic Layer Deposition
| Green
|
+ | ICL |
AME5000
| ERRORERROR
| RIE etcher for frontend silicon processes
| Green
|
+ | ICL |
asher-ICL
| ERRORERROR
| Single wafer oxygen plasma for photoresist removal
| Green
|
+ | ICL |
pTrack
| ERRORERROR
| Automated coater and developer track
| Green
|
+ | ICL |
concept1
| ERRORERROR
| PECVD deposition of oxides, nitrides, and TEOS
| Green
|
+ | ICL |
cv
| ERRORERROR
| Electrical characterization of dielectrics
| Green
|
+ | ICL |
DCVD
| ERRORERROR
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
diesaw
| ERRORERROR
| Wafer dicing saw
| Red
|
+ | ICL |
diesaw-3240
| ERRORERROR
| Wafer dicing saw
| Red
|
+ | ICL |
eBeam-EVO
| ERRORERROR
| Metal evaporator of CMOS compatible metals
| Green
|
+ | ICL |
endura
| ERRORERROR
| Metal sputter deposition
| Green
|
+ | ICL |
epi-Centura
| ERRORERROR
| Not open to public
| Green
|
+ | ICL |
GnP
| ERRORERROR
| Chemical Mechanical Polishing to planarize surfaces
| Red &Green
|
+ | ICL |
goldwire
| ERRORERROR
| Gold ball bonder for device packaging
| Red
|
+ | ICL |
i-stepper
| ERRORERROR
| i-line stepper
| Red &Green
|
+ | ICL |
LAM490B
| ERRORERROR
| Chlorine based plasma etching of silicon
| Green
|
+ | ICL |
LAM590-ICL
| ERRORERROR
| Fluorine based plasma etching of silicon oxide and nitrides
| Green
|
+ | ICL |
nitrEtch-HotPhos
| ERRORERROR
| Hot phosphoric nitride etch bath
| Green
|
+ | ICL |
oxEtch-BOE
| ERRORERROR
| Silicon dioxide etch bath
| Green
|
+ | ICL |
Oxford-100_PECVD
| ERRORERROR
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
Oxford-100_Etch
| ERRORERROR
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
P10
| ERRORERROR
| Stylus profilerometer
| Green
|
+ | ICL |
premetal-Piranha
| ERRORERROR
| Piranha resist removal and cleaning station
| Green
|
+ | ICL |
rainbow
| ERRORERROR
| Chlorine based plasma etcher for metals
| Green
|
+ | ICL |
rca-ICL
| ERRORERROR
| Wafer cleaning before diffusion tubes
| Green
|
+ | ICL |
RTA2
| ERRORERROR
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTA-pieces
| ERRORERROR
| Rapid Thermal Annealing
| Red
|
+ | ICL |
RTP
| ERRORERROR
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTP-Si
| ERRORERROR
| Rapid Thermal Annealing
| Green
|
+ | ICL |
semZeiss
| ERRORERROR
| Scanning Electron Microscope
| Red &Green
|
+ | ICL |
SM-300
| ERRORERROR
| Thickness measurement for CMP processing
| Red &Green
|
+ | ICL |
TMAH-KOHhood
| ERRORERROR
| Silicon bulk wet etching
| Red &Green
|
+ | ICL |
UV1280
| ERRORERROR
| Thin film characterization
| Green
|
+ | ICL |
VTR
| ERRORERROR
| Low stress silicon nitride deposition
| Green
|
+ | ICL |
wykoICL
| ERRORERROR
| Optical profiling system
| Green
|
+ | TRL |
A1-GateOx
| ERRORERROR
| Thermal Oxidation for Green Silicon Wafers
| Green
|
+ | TRL |
A2-WetOxBond
| ERRORERROR
| Thermal Oxidation and other thermal process for GREEN Si wafers
| Green
|
+ | TRL |
A3-Sinter
| ERRORERROR
| Sintering for GREEN Si wafers
| Green
|
+ | TRL |
A4-III-Vanneal
| ERRORERROR
| Annealing for GREEN III-V samples
| Red
|
+ | TRL |
acid-hood
| ERRORERROR
| Acid processing station
| Red &Green
|
+ | TRL |
AJA-TRL
| ERRORERROR
| Sputter deposition tool
| Red
|
+ | TRL |
asherMatrix-TRL
| ERRORERROR
| Single wafer oxygen plasma for photoresist removal
| Red
|
+ | TRL |
asher-TRL
| ERRORERROR
| Barrel asher for resist removal
| Red &Green
|
+ | TRL |
B1-Au
| ERRORERROR
| Gold compatible anneal tube
| Red
|
+ | TRL |
B2-Ox-alloy-Poly
| ERRORERROR
| Thermal Oxidation and LPCVD Polysilicon for RED wafers
| Green
|
+ | TRL |
B3-DryOx
| ERRORERROR
| Thermal Oxidation
| Green
|
+ | TRL |
B4-Poly
| ERRORERROR
| LPCVD polysilicon for Green wafers
| Green
|
+ | TRL |
CCNT
| ERRORERROR
| Carbon nanotube growth
| Red
|
+ | TRL |
coater
| ERRORERROR
| Manual spin-coater for photoresists
| Red &Green
|
+ | TRL |
dek-NoAu
| ERRORERROR
| Stylus Profilerometer
| Green
|
+ | TRL |
dektak-XT
| ERRORERROR
| Stylus Profilerometer
| Red
|
+ | TRL |
develop-Brewer
| ERRORERROR
| Resist develop and postbake
| Red &Green
|
+ | TRL |
eBeamAu
| ERRORERROR
| Metal evaporator
| Red
|
+ | TRL |
eBeamFP
| ERRORERROR
| Fast pumping metal evaporator
| Red
|
+ | TRL |
ellipsometer-TRL
| ERRORERROR
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
EV1
| ERRORERROR
| Contact mask aligner
| Red &Green
|
+ | TRL |
EV501
| ERRORERROR
| Bonder system to apply heat, vacuum and pressure
| Red &Green
|
+ | TRL |
EV620
| ERRORERROR
| Aligner for bonding
| Red &Green
|
+ | TRL |
EV-LC
| ERRORERROR
| Contact mask aligner
| Red &Green
|
+ | TRL |
Filmetrics-TRL
| ERRORERROR
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
FLX
| ERRORERROR
| Thin film stress measurement
| Red &Green
|
+ | TRL |
Greenflo
| ERRORERROR
| Acid processing station
| Red &Green
|
+ | TRL |
Hall-probe
| ERRORERROR
| Carrier measurement
| Red
|
+ | TRL |
Heidelberg
| ERRORERROR
| Laser direct-write exposure for wafers and masks
| Red &Green
|
+ | TRL |
HMDS-TRL
| ERRORERROR
| HMDS oven
| Red &Green
|
+ | TRL |
hotplate1
| ERRORERROR
| Hotplate for lithography
| Red &Green
|
+ | TRL |
hotplate2
| ERRORERROR
| Hotplate for lithography
| Red &Green
|
+ | TRL |
hotplate300
| ERRORERROR
| Hotplate for lithography
| Red &Green
|
+ | TRL |
IV-probe
| ERRORERROR
| Probe station with curve tracer for IV measurement
| Red
|
+ | TRL |
LAM590-TRL
| ERRORERROR
| Fluorine based plasma etching of oxide and nitrides
| Red
|
+ | TRL |
MA-6
| ERRORERROR
| Contact mask aligner
| Red &Green
|
+ | TRL |
MLA-150
| ERRORERROR
| Direct-write lithography for wafers and larger pieces
| Red &Green
|
+ | TRL |
nanospec
| ERRORERROR
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
OAI-Flood
| ERRORERROR
| Flood exposure for image reversal resists
| Red &Green
|
+ | TRL |
parylene
| ERRORERROR
| Parylene depopsition
| Red
|
+ | TRL |
photo-wet-Au
| ERRORERROR
| Solvent fume hood with sonicator
| Red &Green
|
+ | TRL |
photo-wet-l
| ERRORERROR
| Wetbench for photoresist development
| Red &Green
|
+ | TRL |
photo-wet-r
| ERRORERROR
| Wetbench for photoresist development
| Red &Green
|
+ | TRL |
PMMAspinner
| ERRORERROR
| Manual coater for PMMA and other photoresists
| Red &Green
|
+ | TRL |
postbake
| ERRORERROR
| Bake oven 120C
| Red &Green
|
+ | TRL |
prebakeovn
| ERRORERROR
| Bake oven 90C
| Red &Green
|
+ | TRL |
PZTcoater
| ERRORERROR
| Coater to apply PZT films
| Red
|
+ | TRL |
PZTfurnace
| ERRORERROR
| Bake oven for PZT coated wafers
| Red
|
+ | TRL |
rca-TRL
| ERRORERROR
| Wafer cleaning before diffusion tubes
| Green
|
+ | TRL |
Resonetics
| ERRORERROR
| Laser ablation system
| Red
|
+ | TRL |
RTA-HiT
| ERRORERROR
| Rapid Thermal Annealing
| Red
|
+ | TRL |
SAMCO
| ERRORERROR
| Chlorine based plasma etcher for III-V materials
| Red
|
+ | TRL |
SolventHood-TRL
| ERRORERROR
| Solvent fume hood
| Red &Green
|
+ | TRL |
sts1
| ERRORERROR
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
sts2
| ERRORERROR
| Deep reactive ion etcher for silicon
| Green
|
+ | TRL |
sts-CVD
| ERRORERROR
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|
+ | TRL |
sts-Pegasus
| ERRORERROR
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
SU8spinner
| ERRORERROR
| Manual spin-coater for SU8 resists
| Purple
|
+ | TRL |
TBM-8
| ERRORERROR
| Front-to-back alignement measurement
| Red &Green
|
+ | TRL |
UVozone-Au
| ERRORERROR
| Cleans residual organics
| Red
|
+ | TRL |
varTemp
| ERRORERROR
| Bake oven for variable temperature
| Red
|
+ | TRL |
WYKO
| ERRORERROR
| Optical profiling system
| Red &Green
|
+ | TRL |
XeF2
| ERRORERROR
| XeF2 isotropic etching of silicon
| Red
|
+ | LEAP |
X-rayInspection
| ERRORERROR
| X-Ray imaging
| Red
|
+ | LEAP |
PlasmaCleaner
| ERRORERROR
| Plasma parts cleaning
| Red
|
+ | LEAP |
ReflowOven
| ERRORERROR
| Reflow oven
| Red
|
+ | LEAP |
QuickVisionMicroscope
| ERRORERROR
| Automated imaging microscope
| Red
|