Equipment
Lab and Coral NameEML / eBeam-AJA
ModelTBD
SpecialistKurt Broderick    (Timothy Turner, Gary Riggott)
Physical LocationTBD
Classification
Process CategoryDeposition
SubcategoryEvaporate
Material KeywordsCMOS Metals, Non-CMOS Metals, Non-Standard Materials, Photoresist, EBL Resist
Sample Size6" Wafers, 4" Wafers, Pieces
AlternativeTRL / eBeamAu, EML / SputtererAJA
Keywordssingle wafer, manual load, multiple pieces, top side of sample, directional dep, vacuum, manual operation
Description
The eBeam-AJA is a metal evaporator that uses an electron beam to heat a target under ultra-high vacuum. The electron beam that heats the target material sweeps in a pattern to create a small melted area of material. The target atoms then evaporate and precipitate into solid form onto the sample. Without a good vacuum, film quality suffers as the direct path to the substrate is interrupted. Occasionally, outgassing of the target can cause the vaccum to dump and the deposition to be aborted, in which case the recipe can be re-run with adjusted thickness. The deposited film is measured with a crystal. Power levels and ramp-up condition for the electron beam as well as crystal parameters are highly specific to the material deposited. Single 6" wafer via planetary. Smaller samples can be attached to appropriate clip-holders.

Best forDepositing metal patterns through liftoff, broadest range of materials for deposition
LimitationsPump-down time can be as long as 90 minutes. Switching between materials requires cooldown. Only one material can be deposited at a time, although as many as four different materials can be deposited in any sequence.
Characteristics/FOMSingle 6" wafer planetary, or multiple pieces on clip holder. Four crucible slots.
Caution withCaution when loading and unloading of crucibles to avoid jamming the holder. Always inspect crucible fill height at the beginning and during deposition. If deposition rate is atypical, inspect crucible through viewport, and abort process to seek help from staff. Depositing from an empty or damaged crucible can result in severe tool damage.
Machine Charges20/run + 80/um**
Documents

SOP
AJA SputtererSOP for the AJA sputterer
Process Matrix Details


PTC Matrix does not apply for EML
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL