Timothy Turner
Technician A
39-312 - (617)253-3066 - timt@mtl.mit.edu

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Process	Lab	Tool	Process Category	Subcategory	Description	Color Code
+	ICL	diesaw	Packaging	Physical	Wafer dicing saw	Red
+	ICL	goldwire	Packaging	Physical	Gold ball bonder for device packaging	Red
+	LEAP	AutoBonder	Packaging	Physical	Automated wirebonder	Red
+	LEAP	BallBonder	Packaging	Physical	Manual ball bonder	Red
+	LEAP	WedgeBonder	Packaging	Physical	Manual wedge bonder	Red
+	LEAP	X-rayInspection	Packaging	Physical	X-Ray imaging	Red