My Process:

Machines by General Keyword: vacuum

Processing takes place inside a vacuum. Be aware of outgassing or sample requirements (e.g. thin enclosed membranes may not like this)
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ProcessLabToolProcess CategorySubcategoryDescription
Color Code
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EBL Elionix PhotoExpose Electron beam lithography system
Red &Green
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EML ALD-EML DepositionCVD Atomic Layer Deposition
EML
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EML anneal-furnace DiffusionBake Anneal Furnace
EML
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EML asher-EML PhotoClean Oxygen Plasma
EML
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EML BalzerSputterer DepositionSputter Thin sputter coating of samples
EML
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EML Box-Furnace DiffusionBake Anneal Furnace
EML
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EML eBeam-AJA DepositionEvaporate Metal and dielectric evaporator
EML
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EML OxidationTube DiffusionOxidation Oxidation Furnace
EML
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EML plasmatherm Deposition, EtchPECVD, RIE Plasma Etch and Deposition
EML
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EML RTA-EML DiffusionBake Rapid Thermal Annealing
EML
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EML semNeo MetrologySEM Very Basic Electron Microscope
EML
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EML SputtererAJA DepositionSputter Sputter deposition tool
EML
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ICL ALD DepositionCVD Atomic Layer Deposition
Red
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ICL ALD-Oxford DepositionCVD, PECVD Atomic Layer Deposition
Green
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ICL AME5000 EtchRIE RIE etcher for frontend silicon processes
Green
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ICL asher-ICL PhotoClean Single wafer oxygen plasma for photoresist removal
Green
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ICL concept1 DepositionPECVD PECVD deposition of oxides, nitrides, and TEOS
Green
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ICL DCVD DepositionPECVD PECVD deposition of oxides, nitrides, and a-Si
Green
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ICL eBeam-EVO DepositionEvaporate Metal evaporator of CMOS compatible metals
Green
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ICL endura DepositionSputter Metal sputter deposition
Green
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ICL epi-Centura DepositionCVD Not open to public
Green
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ICL LAM490B EtchRIE Chlorine based plasma etching of silicon
Green
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ICL LAM590-ICL EtchRIE Fluorine based plasma etching of silicon oxide and nitrides
Green
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ICL Oxford-100_PECVD Deposition, EtchPECVD Dual chamber PECVD and plasma etch tool
Red
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ICL Oxford-100_Etch Deposition, EtchRIE Dual chamber PECVD and plasma etch tool
Red
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ICL rainbow EtchRIE Chlorine based plasma etcher for metals
Green
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ICL RTA2 DiffusionBake Rapid Thermal Annealing
Green
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ICL RTA-pieces DiffusionBake Rapid Thermal Annealing
Red
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ICL RTP DiffusionBake Rapid Thermal Annealing
Green
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ICL RTP-Si DiffusionBake Rapid Thermal Annealing
Green
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ICL semZeiss MetrologySEM Scanning Electron Microscope
Red &Green
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ICL VTR DiffusionCVD Low stress silicon nitride deposition
Green
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TRL AJA-TRL DepositionSputter Sputter deposition tool
Red
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TRL asherMatrix-TRL PhotoClean Single wafer oxygen plasma for photoresist removal
Red
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TRL asher-TRL PhotoClean Barrel asher for resist removal
Red &Green
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TRL Balzer-Elionix DepositionSputter SEM or EBL sample preparation
Red
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TRL CCNT DepositionPECVD Carbon nanotube growth
Red
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TRL eBeamAu DepositionEvaporate Metal evaporator
Red
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TRL eBeamFP DepositionEvaporate Fast pumping metal evaporator
Red
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TRL HMDS-TRL PhotoBake HMDS oven
Red &Green
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TRL LAM590-TRL EtchRIE Fluorine based plasma etching of oxide and nitrides
Red
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TRL parylene DepositionCVD Parylene depopsition
Red
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TRL plasmaquest EtchRIE Fluorine and Chlorine general purpose plasma deposition and etch tool
Red
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TRL Resonetics PhotoExpose Laser ablation system
Red
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TRL RTA-HiT DiffusionBake Rapid Thermal Annealing
Red
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TRL SAMCO EtchRIE Chlorine based plasma etcher for III-V materials
Red
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TRL sts1 EtchDRIE Deep reactive ion etcher for silicon
Red
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TRL sts2 EtchDRIE Deep reactive ion etcher for silicon
Green
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TRL sts-CVD DepositionPECVD PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
Red
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TRL sts-Pegasus EtchDRIE Deep reactive ion etcher for silicon
Red
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TRL UVozone-Au EtchClean Cleans residual organics
Red
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TRL XeF2 EtchRIE XeF2 isotropic etching of silicon
Red