Equipment
| Lab and Coral Name | EML / BalzerSputterer |
| Model | Balzer |
| Specialist | Kurt Broderick (Timothy Turner, Gary Riggott) |
| Physical Location | TBD |
Classification
| Process Category | Deposition |
| Subcategory | Sputter |
| Material Keywords | Non-CMOS Metals |
| Sample Size | Pieces |
| Alternative | EML / eBeam-AJA, EML / SputtererAJA |
| Keywords | top side of sample, conformal dep, vacuum, plasma, manual operation |
Description
The Balzer-Elionix is primarily used to sputter thin layer of Au. One application is to prevent prevent charging effects on insulating substrates in SEM, ebeam lithography. This tool is simple and fast for this purpose compared to alternatives.
| Best for | Applications require thin layer of Au, such as preventing charging effects in SEM, ebeam lithography on insulating substrates. |
| Limitations | Au only, thin layers. |
| Characteristics/FOM | |
| Caution with | Potential adhesion problem of Au, as no adhesion layers can be deposited with this tool. |
| Machine Charges | 8/hour |
Documents
Process Matrix Details
PTC Matrix does not apply for EML
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL